Thermal conductivity measurements of thin silicon dioxide films in integrated circuits

IEEE Transactions on Electron Devices

Volumn 43, Issue 9, 1996, Pages 1602-1609

  Kleiner, Michael B ^a,b   Kühn, Stefan A ^a   Weber, Werner ^a  

^a SIEMENS AG   (Germany)

^b TECHNICAL UNIVERSITY OF MUNICH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; DIELECTRIC MATERIALS; ELECTRODES; HEAT RESISTANCE; INTEGRATED CIRCUIT LAYOUT; INTEGRATED CIRCUIT TESTING; INTEGRATED CIRCUITS; SILICA; THERMAL CONDUCTIVITY OF SOLIDS; THERMAL VARIABLES MEASUREMENT;

METALLIZATION LAYERS; PARALLEL PLATE ELECTRODES;

THIN FILM DEVICES;

EID: 0030244075     PISSN: 00189383     EISSN: None     Source Type: Journal    
DOI: 10.1109/16.535354     Document Type: Article

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