Effects of self-heating on integrated circuit metallization lifetimes

Technical Digest - International Electron Devices Meeting

Volumn , Issue , 1989, Pages 323-326

  Liew, B K ^a   Cheung, N W ^a   Hu, C ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

METALLIZING--RELIABILITY;

DERATING FACTOR; ELECTROMIGRATION; METALLIZATION LIFETIMES; SELF-HEATING;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0024870512     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)