A new three dimensional IC fabrication technology, stacking thin film DUAL-CMOS layers

Technical Digest - International Electron Devices Meeting, IEDM

Volumn 1991-January, Issue , 1991, Pages 657-660

  Hayashi, Y ^a   Oyama, K ^a   Takahashi, S ^a   Wada, S ^a   Kajiyana, K ^a   Koh, R ^a   Kunio, T ^a  

^a NEC CORPORATION   (Japan)

Author keywords

Annealing; Bonding; CMOS technology; Laser beams; MOSFETs; Optical device fabrication; Ring lasers; Stacking; Three dimensional integrated circuits; Transistors

Indexed keywords

ANNEALING; BONDING; CHEMICAL BONDS; CHEMICAL POLISHING; CMOS INTEGRATED CIRCUITS; ELECTRON DEVICES; LASER BEAMS; RING LASERS; THIN FILMS; THREE DIMENSIONAL INTEGRATED CIRCUITS; TRANSISTORS;

ACTIVE DEVICE LAYERS; ANNEALING TECHNIQUES; CMOS TECHNOLOGY; MOSFETS; OPTICAL DEVICE FABRICATION; RING OSCILLATOR; STACKING; THREE DIMENSIONAL IC;

MOSFET DEVICES;

EID: 84954188403     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEDM.1991.235336     Document Type: Conference Paper

References (0)