A new structure for measuring the thermal conductivity of integrated circuit dielectrics

Test Structures

Volumn , Issue , 1991, Pages 41-45

  Orchard Webb, J H ^a  

^a Mitel Networks Corporation   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

INTEGRATED CIRCUITS - MATERIALS; TEMPERATURE MEASUREMENT; THERMAL CONDUCTIVITY - MEASUREMENTS;

INTEGRATED CIRCUIT DIELECTRICS; INTERMETAL DIELECTRIC; INTERPOLY DIELECTRIC; MICROELECTRONIC DIELECTRICS;

DIELECTRIC MATERIALS;

EID: 0026374401     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)