On the constant composition and thickness of the chlorinated silicon surface layer subjected to increasing etching product concentrations during chlorine plasma etching

Journal of Applied Physics

Volumn 86, Issue 4, 1999, Pages 1822-1833

  Bogart, K H A ^a   Donnelly, V M ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0001183573     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.370975     Document Type: Article

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