Role of etch products in polysilicon etching in a high-density chlorine discharge

Plasma Chemistry and Plasma Processing

Volumn 16, Issue 1, 1996, Pages 99-120

  Lee, C ^a   Graves, D B ^c   Lieberman, M A ^b  

^a University of California   (United States)

^b UNIVERSITY OF CALIFORNIA   (United States)

^c NONE

Author keywords

Etch products; Ion flux limited; Neutral limited; Nonreactive wall; Reactive wall

Indexed keywords

EID: 0002226179     PISSN: 02724324     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF01465219     Document Type: Article

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