Key reliability factors for IC and MEMS packaging

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)

Volumn 2000-AB, Issue , 2000, Pages 623-627

  Ghaffarian, Reza ^a  

^a CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMOBILES; ELECTROMECHANICAL DEVICES; ENVIRONMENTAL TECHNOLOGY; INTEGRATED CIRCUITS; PACKAGING; RELIABILITY ANALYSIS; TIMING CIRCUITS;

COMMERCIAL APPLICATIONS; COMMERCIAL OFF-THE-SHELF COMPONENTS; COST SAVING; ENVIRONMENTAL APPLICATIONS; HIGH RELIABILITY; IC PACKAGING; MEMS PACKAGING; RELIABILITY FACTOR; RESEARCH AND DEVELOPMENT; TECHNOLOGY DEVELOPMENT;

MEMS;

EID: 85013982176     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2000-1155     Document Type: Conference Paper

References (24)

1. R. Ghaffarian, "Chip Scale Packaging Guidelines," Interconnect Technology Research Institute (ITRI), August 1998, http://www.ITRI.org, April 2000
2. R. Ghaffarian, "Ball Grid Array Packaging Guidelines," Interconnect Technology Research Institute (ITRI), August 1998, http://www.ITRI.org
3. rd IEEE solid-state sensor and actuator workshop, Hilton Head Island, S.C., June 6 - 8, 1988.
4. R. Frank, M.L. Kniffin, and L. Ristic, Chapter 6 in Sensors Technology Edited by Ljubisa Ristic, Artech House, Boston, 1994.
5. S.D. Senturia and R.L. Smith, "Microsensor packaging and system partitioning," Sensors and Actuators, 15,221 - 234 (1988).
6. H. Reichl, "Environmental Screening of Packaging and interconnections," Environmentally Conscious Design and Inverse Manufacturing, 1999. Proceedings. EcoDesign '99: First International Symposium On, Page(s): 754 -759
7. N.P. Kim, K. Li, D.J. Kovach, C-P. Chen and M.H. Tanielian, "Smart Sensor Multi-Chip Module with Direct-Chip-Attached Micro-Electro-Mechanical System (MEMS) Devices", to be published in 1999 IMAPS Proceedings, Chicago, IL, Oct 1999.
8. A.D. Romig (Jr), P.V. Dressendorfer, D.W. Palmer, "High performance microsystem packaging: a perspective," Microelectronics and Reliability v 37, n 10-11, Oct-Nov 1997.
9. S.B. Brown, W. van Arsdell and C.L. Muhlstein, "Materials reliability in MEMS devices," Tranducers 97, International Conference on Solid-State Sensors and Actuators, Vol.1 p.591-593, 1997.
10. S. Petrovic, A. Ramirez, T. Maudie, D. Stanerson, J. Wertz, G. Bitko, J. Matkin and D.J. Monk, "Reliability test methods for media-compatible pressure sensors," IEEE Transactions on Industrial Electronics v 45 n 6 Dec 1998. P 877-885.
11. K. Dyrbye, T.R. Brown, G.F. Eriksen, F. Gert and D. Bjerringbro, "Packaging of physical sensors for aggressive media applications" J. Micromechanics and Microengineering v 6, n 1, p 187-192, Mar 1996.
12. W.M. Miller, D.M. Tanner, S.L. Miller and K. Peterson, "A.MEMS reliability: The challenge and the promise," SAND-98-0630C; CONF-980558, 9p, 31 May 1998.
13. D. Tanner, W.M. Miller, W.P. Eaton, L.W. Irwin, K.A. Peterson, M.T. Dugger, D.C. Senft, N.F. Smith, P. Tangyunyong and S.L. Miller, "The Effect of Frequency on the Lifetime of a Surface Micromachined Microengine Driving a Load," 1998 IEEE International Reliability Physics Proceedings, pp. 26-35.
14. D. M. Tanner, J. A. Walraven, L. W. Irwin, M. T. Dugger, N. F. Smith, W. M. Miller, and S. L. Miller, Proc. Of IEEE International Reliability Physics Symposium, pp. 189-197, 1999.
15. Patton, S.T., et al, "Performance and Reliability of a New MEMS Electrostatic Lateral Output Motor," IEEE International Reliability Physics Proceedings, pp. 179-189,1999.
16. G. Kelly, J. Alderman, C. Lyden, J. Barret, "Microsystem packaging: Lessons from conventional low cost IC packaging," Proc. Micro Mechanics Europe, Barcelona, pp. 219 - 224, October 21 - 22, 1996.
17. L. Muller, M.H. Hecht, L.M. Miller, H.K. Rockstad, J.C. Lyke, " Packaging and qualification of MEMS-based space systems," Proceedings of the 9th Annual International, Workshop on Micro Electro Mechanical Systems, 1995.
18. th Annual International Workshop on MEMS: an Investigation of microstructures, sensors, actuators, machines, and robots: proceedings, Nagoya, Japan, pp. 500 - 505, January 26-30,1997.
19. L.M. Miller, "MEMS for Space Applications" Proceedings of SPIE, Design, Test, and Microfabrication of MEMS and MOEMS, Vol 3680, SPIE, Edited by B. Courtois, S.B. Crary, W. Ehrfeld, H. Fujita, J. M. Karam, K. Markus, 30 March - 1 April 1999, Paris, France.
20. F. Hartley, "Terrestrial Applications of a Nano-g Accelerometer, "Proceedings of Sensors Expo, Baltimore, Maryland, pp. 359-362, May 4-6, 1999.
21. R. Grace, "Automotive Applications of MEMS/MST/Micromachines," Proceedings of Sensors Expo, Baltimore, Maryland, May 4-6, 1999, pp. 351-358.
22. A. Hartzel and D. Woodilla, "Reliability Methodology for Predicition of Micromachined Accelerometer Stiction," IEEE International Reliability Physics Proceedings, pp. 202-205,1999.
23. L. Spangler, "Integrated Circuit Package Technology for Micromachined Accelerometers," NEPCON 1999 proceedings, pp. 1007-1013, 1999.
24. F. Smith, "MEMS Total Pressure Probe Progress Report," IMAPS Southern California Symposium, May 12-13, 1999.