Integrated circuit package technology for micromachined accelerometers

National Electronic Packaging and Production Conference-Proceedings of the Technical Program (West and East)

Volumn 2, Issue , 1999, Pages 1007-1013

  Spangler, Leland ^a  

^a Ford Microelectronics Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACCELEROMETERS; AUTOMOBILE AIR BAGS; INTEGRATED CIRCUIT MANUFACTURE; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; MICROSENSORS; SILICON SENSORS; TRANSDUCERS;

SILICON MICROMACHINED ACCELEROMETERS;

ELECTRONICS PACKAGING;

EID: 0032682833     PISSN: 04700155     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (0)