High performance microsystem packaging: A perspective

Microelectronics Reliability

Volumn 37, Issue 10-11, 1997, Pages 1771-1781

  Romig Jr , A D ^a   Dressendorfer, P V ^a   Palmer, D W ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INTEGRATED CIRCUIT LAYOUT; MICROELECTROMECHANICAL DEVICES; MICROELECTRONIC PROCESSING; MULTICHIP MODULES; RELIABILITY; SEMICONDUCTING SILICON;

INTEGRATED MICROSYSTEMS; PACKAGING DESIGN;

ELECTRONICS PACKAGING;

EID: 0031246426     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(97)00158-3     Document Type: Article

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