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Volumn 615, Issue , 2000, Pages
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Room temperature recrystallization of electroplated copper thin films: Methods and mechanisms
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Author keywords
[No Author keywords available]
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Indexed keywords
COPPER;
CRYSTALLOGRAPHY;
DATA REDUCTION;
ELECTROPLATING;
GRAIN BOUNDARIES;
ION BEAMS;
RECRYSTALLIZATION (METALLURGY);
TEXTURES;
X RAY DIFFRACTION ANALYSIS;
GRAIN GROWTH;
IMAGE ANALYSIS;
NUCLEATION;
PHASE TRANSITIONS;
FOCUSED ION BEAM (FIB) MICROSCOPES;
SHEET RESISTANCE;
THIN FILMS;
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EID: 85009889650
PISSN: 02729172
EISSN: None
Source Type: Journal
DOI: 10.1557/proc-612-d10.1.1 Document Type: Article |
Times cited : (23)
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References (22)
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