Electroplated damascene copper: Process influences on recrystallization and texture

Materials Research Society Symposium - Proceedings

Volumn 564, Issue , 1999, Pages 379-386

  Gross, M E ^a   Drese, R ^a   Lingk, C ^b   Brown, W L ^a   Evans Lutterodt, K ^a   Barr, D ^a   Golovin, D ^a   Ritzdorf, T ^c   Turner, J ^c   Graham, L ^c  

^a LUCENT TECHNOLOGIES   (United States)

^b UNIVERSITY OF MUNICH   (Germany)

^c Semitool Incorporated   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITION REACTIONS; COMPOSITION EFFECTS; COPPER; ELECTROLYSIS; ELECTROPLATING; METALLIC FILMS; METALLOGRAPHIC MICROSTRUCTURE; RECRYSTALLIZATION (METALLURGY); X RAY DIFFRACTION ANALYSIS;

ADSORBATE/SURFACE INTERACTIONS; DAMASCENE COPPER;

ELECTRIC CONTACTS;

EID: 0033279578     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-564-379     Document Type: Article

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