Stacked integration of MEMS on LSI

Micromachines

Volumn 7, Issue 8, 2016, Pages

  Esashi, Masayoshi ^a   Tanaka, Shuji ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

LSI; MEMS; Stacked integration; Through Si vias; Wafer level transfer

Indexed keywords

ACOUSTIC RESONATORS; ACOUSTIC SURFACE WAVE FILTERS; ACOUSTIC WAVES; ELECTROMECHANICAL DEVICES; ELECTRON BEAM LITHOGRAPHY; FERROELECTRIC CERAMICS; LEAD ZIRCONATE TITANATE; LSI CIRCUITS; MEMS;

ELECTRICAL INTERCONNECTIONS; FILM BULK ACOUSTIC RESONATORS; INTEGRATION METHOD; MICRO ELECTROMECHANICAL SYSTEM (MEMS); SELECTIVE TRANSFER; SURFACE ACOUSTIC WAVE RESONATORS; THROUGH SI VIAS; WAFER LEVEL;

SILICON WAFERS;

EID: 84984830284     PISSN: None     EISSN: 2072666X     Source Type: Journal    
DOI: 10.3390/mi7080137     Document Type: Article

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