A 1.7mm3 MEMS-on-CMOS tactile sensor using human-inspired autonomous common bus communication

2013 Transducers and Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013

Volumn , Issue , 2013, Pages 2729-2732

  Makihata, M ^a   Muroyama, M ^a   Nakano, Y ^a   Tanaka, S ^a   Nakayama, T ^b   Yamaguchi, U ^b   Yamada, H ^b   Nonomura, Y ^c   Funabashi, H ^c   Hata, Y ^c   Esashi, M ^a  

^a TOHOKU UNIVERSITY   (Japan)

^b TOYOTA MOTOR CORPORATION   (Japan)

^c Rd Management Section   (Japan)

Author keywords

MEMS CMOS integration; sensor network; Tactile sensor; wafer level packaging

Indexed keywords

FLEXIBLE PRINTED CIRCUIT BOARDS; INTEGRATION TECHNOLOGIES; REDUCTION PROCESSING; SERIAL BUS COMMUNICATION; TACTILE SENSOR SYSTEMS; TACTILE SENSORS; THRESHOLD OPERATION; WAFER LEVEL PACKAGING;

ACTUATORS; APPLICATION SPECIFIC INTEGRATED CIRCUITS; CARRIER COMMUNICATION; DATA REDUCTION; IMAGE SEGMENTATION; SENSOR NETWORKS; SOLID-STATE SENSORS; SYSTEM BUSES;

MICROSYSTEMS;

EID: 84891666970     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/Transducers.2013.6627370     Document Type: Conference Paper

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