Integration and packaging technology of MEMS-on-CMOS capacitive tactile sensor for robot application using thick BCB isolation layer and backside-grooved electrical connection

Sensors and Actuators, A: Physical

Volumn 188, Issue , 2012, Pages 103-110

  Makihata, M ^a   Tanaka, S ^a   Muroyama, M ^a   Matsuzaki, S ^a   Yamada, H ^b   Nakayama, T ^b   Yamaguchi, U ^b   Mima, K ^b   Nonomura, Y ^c   Fujiyoshi, M ^c   Esashi, M ^a  

^a TOHOKU UNIVERSITY   (Japan)

^b TOYOTA MOTOR CORPORATION   (Japan)

^c Rd Management Section   (Japan)

Author keywords

BCB; Chip size packaging; MEMS CMOS integration; Molding; Tactile senor

Indexed keywords

ADHESIVE LAYERS; BACK END OF LINES; BCB; BENZOCYCLOBUTENE; BOND PAD; CAPACITANCE ELECTRODES; CAPACITIVE FORCES; CMOS CIRCUITS; CMOS WAFERS; ELECTRICAL CONNECTION; ELECTRICAL FEEDS; FEED LINE; FLAT SURFACES; GLASS MOLDS; INTEGRATION AND PACKAGING TECHNOLOGY; SCRIBE LINES; SENSOR CHIPS; SURFACE MOUNTING; TACTILE SENOR; TACTILE SENSORS; TETRAMETHYL AMMONIUM HYDROXIDE; VIA HOLE; WAFER LEVEL; WAFER-LEVEL INTEGRATION;

AMMONIUM COMPOUNDS; BUTENES; CAPACITANCE; CHIP SCALE PACKAGES; CMOS INTEGRATED CIRCUITS; ELECTRIC CONNECTORS; ELECTRODES; MOLDING; SENSORS; SURFACE MOUNT TECHNOLOGY; WAFER BONDING; WET ETCHING;

CAPACITIVE SENSORS;

EID: 84870061598     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2012.04.032     Document Type: Conference Paper

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