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Volumn 15, Issue 1, 2016, Pages 5-8

Dynamic resource sharing for high-performance 3-D networks-on-chip

Author keywords

3 D integration; Network on chip; Resource sharing

Indexed keywords

BANDWIDTH; DISTRIBUTED COMPUTER SYSTEMS; ROUTERS; VLSI CIRCUITS;

EID: 84976482172     PISSN: 15566056     EISSN: None     Source Type: Journal    
DOI: 10.1109/LCA.2015.2448532     Document Type: Article
Times cited : (11)

References (12)
  • 2
    • 84862734440 scopus 로고    scopus 로고
    • Fine-grained bandwidth adaptivity in networks-on-chip using bidirectional channels
    • May
    • R. Hesse, J. Nicholls, and N. E. Jerger, "Fine-grained bandwidth adaptivity in networks-on-chip using bidirectional channels," in Proc. 6th Int. Symp. Netw.-on-Chip, May 2012, pp. 132-141.
    • (2012) Proc. 6th Int. Symp. Netw.-on-Chip , pp. 132-141
    • Hesse, R.1    Nicholls, J.2    Jerger, N.E.3
  • 7
    • 84903201439 scopus 로고    scopus 로고
    • Power-aware NoCs through routing and topology reconfiguration
    • Jun
    • R. Parikh, R. Das, and V. Bertacco, "Power-aware NoCs through routing and topology reconfiguration," in Proc. 51st Annu. Design Automation Conf., Jun. 2014, pp. 162: 1-162: 6.
    • (2014) Proc. 51st Annu. Design Automation Conf , pp. 1621-1626
    • Parikh, R.1    Das, R.2    Bertacco, V.3
  • 10
    • 84873724491 scopus 로고    scopus 로고
    • Developing a power-efficient and low-cost 3D NoC using smart GALS-based vertical channels
    • Jun
    • A.-M. Rahmani, P. Liljeberg, J. Plosia, and H. Tenhunen, "Developing a power-efficient and low-cost 3D NoC using smart GALS-based vertical channels," J. Comput. Syst. Sci., vol. 79, no. 4, pp. 440-456, Jun. 2013.
    • (2013) J. Comput. Syst. Sci , vol.79 , Issue.4 , pp. 440-456
    • Rahmani, A.-M.1    Liljeberg, P.2    Plosia, J.3    Tenhunen, H.4
  • 12
    • 77952554764 scopus 로고    scopus 로고
    • An optimized 3D-stacked memory architecture by exploiting excessive, high-density TSV bandwidth
    • Jan
    • D. H. Woo, N. H. Seong, D. L. Lewis, and H.-H. S. Lee, "An optimized 3D-stacked memory architecture by exploiting excessive, high-density TSV bandwidth," in Proc. Int. Symp. High-Perform. Comput. Archit., Jan. 2010, pp. 1-12.
    • (2010) Proc. Int. Symp. High-Perform. Comput. Archit , pp. 1-12
    • Woo, D.H.1    Seong, N.H.2    Lewis, D.L.3    Lee, H.-H.S.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.