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Hi-rise: A high-radix switch for 3D integration with single-cycle arbitration
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S. Jeloka, R. Das, R. G. Dreslinski, T. Mudge, and D. Blaauw, "Hi-rise: A high-radix switch for 3D integration with single-cycle arbitration," in Proc. Annu. IEEE/ACM Int. Symp. Microarchit., Dec. 2014, pp. 471-483.
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A novel dimensionally-decomposed router for onchip communication in 3D architectures
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J. Kim, C. Nicopoulos, D. Prak, R. Das, Y. Xie, N. Vijaykrishnan, M. S. Yousif, and C. R. Das, "A novel dimensionally-decomposed router for onchip communication in 3D architectures," in Proc. Annu. Int. Symp. Comput. Archit., Nov. 2007, pp. 138-149.
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R. Parikh, R. Das, and V. Bertacco, "Power-aware NoCs through routing and topology reconfiguration," in Proc. 51st Annu. Design Automation Conf., Jun. 2014, pp. 162: 1-162: 6.
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D. Park, S. Eachempati, R. Das, A. K. Mishra, Y. Xie, N. Vijaykrishnan, and C. R. Das, "MIRA: A multi-layered on-chip interconnect router architecture," in Proc. 35th Annu. Int. Symp. Comput. Archit.,Nov. 2008, pp. 251-261.
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Developing a power-efficient and low-cost 3D NoC using smart GALS-based vertical channels
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C. Seiculescu, S. Murali, L. Benini, and G. De Micheli, "SunFloor 3D: A tool for networks on chip topology synthesis for 3D systems on chips," in Proc. Design, Automation Test Eur. Conf. Exhib., Apr. 2009, pp. 9-14.
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An optimized 3D-stacked memory architecture by exploiting excessive, high-density TSV bandwidth
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D. H. Woo, N. H. Seong, D. L. Lewis, and H.-H. S. Lee, "An optimized 3D-stacked memory architecture by exploiting excessive, high-density TSV bandwidth," in Proc. Int. Symp. High-Perform. Comput. Archit., Jan. 2010, pp. 1-12.
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