MEMS vacuum packaging technology and applications

Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003

Volumn , Issue , 2003, Pages 301-306

  Jin, Y ^a   Wang, Z F ^a   Lim, P C ^a   Pan, D Y ^a   Wei, J ^a   Wong, C K ^a  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROMECHANICAL DEVICES; ELECTRONICS PACKAGING; GETTERS; GLASS; MEMS; MICROELECTROMECHANICAL DEVICES; SILICON WAFERS; VACUUM APPLICATIONS; WAFER BONDING;

EUTECTIC BONDING; GLASS FRIT BONDINGS; IMPERFECT INTERFACE; MICRO ELECTROMECHANICAL SYSTEM (MEMS); NON-EVAPORABLE GETTER FILMS; PACKAGING PROCESS; PERFORMANCE AND RELIABILITIES; SEALING TECHNIQUE;

GLASS BONDING;

EID: 84954039443     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2003.1271534     Document Type: Conference Paper

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