Low Temperature Sintering Cu6Sn5 Nanoparticles for Superplastic and Super-uniform High Temperature Circuit Interconnections

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Volumn 11, Issue 33, 2015, Pages 4097-4103

  Zhong, Ying ^a   An, Rong ^a   Wang, Chunqing ^a   Zheng, Zhen ^a   Liu, Zhi Quan ^c   Liu, Chin Hung ^b   Li, Cai Fu ^c   Kim, Tae Kyoung ^b   Jin, Sungho ^b  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

^b UNIVERSITY OF CALIFORNIA   (United States)

^c INSTITUTE OF METAL RESEARCH   (China)

Author keywords

high temperature interconnection; intermetallics; nanoparticles; sintering; TEM

Indexed keywords

BINARY ALLOYS; COPPER ALLOYS; INTERMETALLICS; NANOPARTICLES; TEMPERATURE; TIMING CIRCUITS; TIN ALLOYS; TRANSMISSION ELECTRON MICROSCOPY;

HIGH TEMPERATURE CIRCUITS; HIGH TEMPERATURE INTERCONNECTION; HIGH-TEMPERATURE RESISTANT; IN-SITU TEM; LOW COSTS; LOW-TEMPERATURE SINTERING; NANO GRAINS;

SINTERING;

EID: 84940790859     PISSN: 16136810     EISSN: 16136829     Source Type: Journal    
DOI: 10.1002/smll.201500896     Document Type: Article

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