Extended PDMS stiffness range for flexible systems

Sensors and Actuators, A: Physical

Volumn 230, Issue , 2015, Pages 33-39

  Seghir, R ^a   Arscott, S ^a  

^a UNIV LILLE   (France)

Author keywords

Curing; Flexible electronics; Flexible systems; Mechanical properties; Mixing ratio; Polydimethylsiloxane; Process parameters; Rupture; Wetting contact angle

Indexed keywords

ARTIFICIAL ORGANS; CONTACT ANGLE; CURING; ELASTIC MODULI; FLEXIBLE ELECTRONICS; MECHANICAL PROPERTIES; MICROCHANNELS; MIXING; POLYDIMETHYLSILOXANE; POLYMERS; STIFFNESS; THERMAL EXPANSION; WETTING;

FLEXIBLE SYSTEM; MIXING RATIOS; PROCESS PARAMETERS; RUPTURE; WETTING CONTACT ANGLES;

SILICONES;

EID: 84929191653     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2015.04.011     Document Type: Article

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