Study of novel electrical routing and integrated packaging on bio-compatible flexible substrates

Microsystem Technologies

Volumn 16, Issue 3, 2010, Pages 423-430

  Hocheng, Hong ^a   Chen, Chao Ming ^a   Chou, Yu Chang ^a   Lin, Chien Hung ^b  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b CHINESE CULTURE UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CURING CONDITION; ELECTRICAL CIRCUIT; FLEXIBLE PACKAGES; FLEXIBLE PACKAGINGS; FLEXIBLE SUBSTRATE; FUNCTIONAL SYSTEMS; INTEGRATED PACKAGING; MOVING COMPONENTS; NON-PLANAR SURFACES; PACKAGING METHODS; PACKAGING PROCESS; POLYDIMETHYLSILOXANE PDMS; STATIONARY COMPONENTS; YOUNG'S MODULUS;

CHIP SCALE PACKAGES; ELECTRIC NETWORK ANALYSIS; SILICONES;

PACKAGING;

EID: 73349139499     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-009-0930-2     Document Type: Article

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