Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu

Scientific Reports

Volumn 5, Issue , 2015, Pages

  Liu, Chien Min ^a   Lin, Han Wen ^a   Huang, Yi Sa ^a   Chu, Yi Cheng ^a   Chen, Chih ^a   Lyu, Dian Rong ^a   Chen, Kuan Neng ^a   Tu, King Ning ^b  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^b UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 84929180063     PISSN: None     EISSN: 20452322     Source Type: Journal    
DOI: 10.1038/srep09734     Document Type: Article

References (22)

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