Influence of small amount of Al and Cu on the microstructure, microhardness and tensile properties of Sn-9Zn binary eutectic solder alloy

Journal of Alloys and Compounds

Volumn 481, Issue 1-2, 2009, Pages 167-172

  Das, S K ^a   Sharif, A ^b   Chan, Y C ^a   Wong, N B ^a   Yung, W K C ^c  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^b BANGLADESH UNIVERSITY OF ENGINEERING AND TECHNOLOGY   (Bangladesh)

^c HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

Author keywords

Intermetallic compound (IMC); Mechanical property; Microstructure; Sn Zn eutectic solder; Thermal behavior

Indexed keywords

BINARY EUTECTICS; CU ALLOY; EUTECTIC SOLDERS; FLOWER-SHAPED; INTERMETALLIC COMPOUND (IMC); INTERMETALLIC COMPOUNDS; MATRIX; MICRO-STRUCTURAL; NEEDLE-LIKE; ROD-SHAPED; SECOND PHASE; SN-ZN EUTECTIC SOLDER; SOLDER ALLOYS; STRENGTHENING MECHANISMS; TERNARY SOLDERS; THERMAL BEHAVIOR; THERMAL BEHAVIORS; WEAK INTERFACE;

ALLOYS; ALUMINUM; BRAZING; CERIUM ALLOYS; COPPER ALLOYS; EUTECTICS; MECHANICAL PROPERTIES; MICROHARDNESS; MICROSTRUCTURE; PHASE INTERFACES; SEMICONDUCTING INTERMETALLICS; SOLDERING ALLOYS; STRENGTH OF MATERIALS; TENSILE STRENGTH; TIN ALLOYS; WELDING; ZINC;

TIN;

EID: 67649291769     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2009.03.017     Document Type: Article

References (34)

1. Vianco P.T., and Frear D.R. JOM 45 (1993) 14
2. Morris Jr. J.W., Freer Goldstein J.L., and Mei Z. JOM 45 (1993) 25
3. Raeder C.H., Felton L.E., Tanzi V.A., and Knorr D.B. J. Electron. Mater. 23 (1994) 611
4. Felton L.E., Raeder C.H., and Knorr D.B. JOM 45 7 (1993) 28
5. Winterbottom W.L. JOM 45 (1993) 20
6. Tomlinson W.J., and Collier I. J. Mater. Sci. 22 (1987) 1835
7. Harada M., and Satoh R. IEEE Trans. Comp. Hybrids Manuf. Technol. 13 (1990) 736
8. Mei Z., and Morris Jr. J.W. J. Electron. Mater. 21 (1992) 599
9. McCormack M., Jin S., Kammlott G.W., and Chen H.S. Appl. Phys. Lett. 63 (1993) 15
10. McCormack M., Jin S., Chen H.S., and Machusak D.A. J. Electron. Mater. 23 (1994) 687
11. McCormack M., and Jin S. J. Electron. Mater. 23 (1994) 635
12. Masson D.B., and Kirkpatrick B.K. J. Electron. Mater. 15 (1986) 349
13. Ghosh G., Loomans M., and Fine M.E. J. Electon. Mater. 23 (1994) 619
14. Kattner U.R., and Boettinger W.J. J. Electron. Mater. 23 (1994) 603
15. Miller C.M., Anderson I.E., and Smith J.F. J. Electron. Mater. 23 (1994) 595
16. McCormack M., Jin S., and Chen H.S. J. Electron. Mater. 23 (1994) 687
17. Sebaoun A., Vincent D., and Treheux D. Mater. Sci. Technol. 3 (1987) 241
18. Suganuma K., Murata T., Noguchi H., and Toyoda Y. J. Mater. Res. 15 (2000) 884
19. Lee H.M., Yoon S.W., and Lee B.J. J. Electron. Mater. 27 (1998) 1161
20. Lin K.L., and Wen L.H. J. Mater. Sci.: Mater. Electron. 9 (1998) 5
21. Lin K.L., and Wang Y.C. J. Electron. Mater. 27 (1998) 1205
22. Yu S.P., Wang H.C., Hon M.H., and Wang M.C. JOM 52 (2000) 36
23. Yu S.P., Wang M.C., and Hon M.H. J. Mater. Res. 16 (2001) 76
24. Lin W.L., Wen L.H., and Liu T.P. J. Electron. Mater. 27 (1998) 1007
25. Shohji I., Nakamura T., Mori F., and Fujiuchi S. J. Mater. Trans. 43 (2002) 1797
26. Soares D., Vilarinho C., Barbosa J., Silva R., Pinho M., and Castro F. Mater. Sci. Forum 455-456 (2004) 307
27. Chuang C.M., Lui T.S., and Chen L.H. J. Mater. Sci. 37 (2002) 191
28. Wu C.M.L., and Wong Y.W. J. Mater. Sci: Mater. Electron. 18 (2007) 77
29. Huang C.W., and Lin K.L. J. Mater. Res. 18 (2003) 1528
30. Murray J.L. Bull. Alloy Phase Diagrams 4 (1983) 55
31. Chen K.I., Cheng S.C., Wu S., and Lin K.L. J. Alloys Compd. 416 (2006) 98
32. Frear D., Morgan H., Burchett S., and Lau J. The Mechanics of Solder Alloy Interconnects (1994), Van Nostrand Reinhold, New York
33. Callister W.D. Materials Science and Engineering an Introduction. 4th ed. (1996), John Wiley & Sons Inc., Canada
34. Dieter G.E. Mechanical Metallurgy (1986), McGraw-Hill Book Co, New York