Influence of flux on wetting behavior of lead-free solder balls during the infrared-reflow process

Journal of Electronic Materials

Volumn 34, Issue 7, 2005, Pages 994-1001

  Chung, Cho Liang ^a   Moon, Kyoung Sik ^b   Wong, C P ^b  

^a I SHOU UNIVERSITY   (Taiwan)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Flux; Lead free solder (Sn 3.5Ag 0.5Cu); Temperature cycle test

Indexed keywords

HEAT RESISTANCE; INFRARED RADIATION; MELTING; OPTICAL MICROSCOPY; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH; SOLDERING ALLOYS; THERMOGRAVIMETRIC ANALYSIS; VIDEOCASSETTE RECORDERS; WETTING;

FLUX; INFRARED-REFLOW PROCESS; LEAD-FREE SOLDER (SN-3.5AG-0.5CU); TEMPERATURE CYCLE TEST;

FLUXES;

EID: 23244443955     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-005-0086-5     Document Type: Article

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