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Journal of Materials Science: Materials in Electronics

Volumn 24, Issue 6, 2013, Pages 2052-2057

Formation of Sn-Bi solder alloys by sequential electrodeposition and reflow

(3) Goh, Yingxin a Lee, Seen Fang a Haseeb, A S Md Abdul a

a UNIVERSITY OF MALAYA (Malaysia)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRODEPOSITION METHODS; ELECTRONIC DEVICE; ELECTRONIC PACKAGING INDUSTRY; HOMOGENEOUS MICROSTRUCTURE; LOW MELTING TEMPERATURES; METAL STACKS; SOLDER ALLOYS; SOLDER BUMP;

ALLOYS; ELECTRODEPOSITION; EUTECTICS; MECHANICAL PROPERTIES; MICROSTRUCTURE; TIN ALLOYS;

TIN;

EID: 84878709564 PISSN: 09574522 EISSN: 1573482X Source Type: Journal
DOI: 10.1007/s10854-012-1055-4 Document Type: Article

Times cited : (9)

References (27)

1
- 32544433271
- 10.1016/j.surfcoat.2004.08.162 1:CAS:528:DC%2BD28Xhs1yrur0%3D
- M.-S. Suh, C.-J. Park, H.-S. Kwon, Surf. Coat. Technol. 200, 3527 (2006)
- (2006) Surf. Coat. Technol. , vol.200 , pp. 3527
- Suh, M.-S.¹ Park, C.-J.² Kwon, H.-S.³

2
- 79958733705
- 10.1007/s12540-011-0216-y 1:CAS:528:DC%2BC3MXivFyisb8%3D
- Y.-G. Lee, J.-G. Park, C.-W. Lee, J.-P. Jung, Met. Mater. Int. 17, 117 (2011)
- (2011) Met. Mater. Int. , vol.17 , pp. 117
- Lee, Y.-G.¹ Park, J.-G.² Lee, C.-W.³ Jung, J.-P.⁴

3
- 80051715221
- 10.1149/1.3594733 1:CAS:528:DC%2BC3MXotVyit74%3D
- Y.-D. Tsai, C-.C. Hu, J. Electrochem. Soc. 158, D482 (2011)
- (2011) J. Electrochem. Soc. , vol.158 , pp. 482
- Tsai, Y.-D.¹ Hu, C.-C.²

4
- 80052273373
- 10.1016/j.electacta.2011.06.077 1:CAS:528:DC%2BC3MXhtVygsrvL
- Y.-D. Tsai, C.-H. Lien, C-.C. Hu, Electrochim. Acta 56, 7615 (2011)
- (2011) Electrochim. Acta , vol.56 , pp. 7615
- Tsai, Y.-D.¹ Lien, C.-H.² Hu, C.-C.³

5
- 58049130201
- 10.1149/1.3035824 1:CAS:528:DC%2BD1cXhsFCitr7M
- Y.-D. Tsai, C-.C. Hu, J. Electrochem. Soc. 156, D58 (2009)
- (2009) J. Electrochem. Soc. , vol.156 , pp. 58
- Tsai, Y.-D.¹ Hu, C.-C.²

6
- 70349750305
- 10.1149/1.3224861 1:CAS:528:DC%2BD1MXht1WrsLnE
- Y.-D. Tsai, C-.C. Hu, J. Electrochem. Soc. 156, D490 (2009)
- (2009) J. Electrochem. Soc. , vol.156 , pp. 490
- Tsai, Y.-D.¹ Hu, C.-C.²

7
- 35548958627
- 10.1016/j.electacta.2007.09.002 1:CAS:528:DC%2BD2sXht1Ght77K
- Y.-D. Tsai, C-.C. Hu, C-.C. Lin, Electrochim. Acta 53, 2040 (2007)
- (2007) Electrochim. Acta , vol.53 , pp. 2040
- Tsai, Y.-D.¹ Hu, C.-C.² Lin, C.-C.³

8
- 0035047957
- 10.1016/S1359-0286(00)00036-X 1:CAS:528:DC%2BD3MXjslCiur0%3D
- K. Suganuma, Curr. Opin. Solid St. M. 5, 55 (2001)
- (2001) Curr. Opin. Solid St. M. , vol.5 , pp. 55
- Suganuma, K.¹

9
- 84857645589
- 10.1007/s10853-012-6257-x 1:CAS:528:DC%2BC38XntlyitA%3D%3D
- C. Fuchs, T. Schreck, M. Kaloudis, J. Mater. Sci. 47, 4036 (2012)
- (2012) J. Mater. Sci. , vol.47 , pp. 4036
- Fuchs, C.¹ Schreck, T.² Kaloudis, M.³

10
- 0036826462
- 10.1109/TEPM.2002.807718 1:CAS:528:DC%2BD3sXhslGgsLk%3D
- K. Suganuma, T. Sakai, K.S. Kim, Y. Takagi, J. Sugimoto, M. Ueshima, IEEE Trans. Electron. Packag. Manuf. 25, 257 (2002)
- (2002) IEEE Trans. Electron. Packag. Manuf. , vol.25 , pp. 257
- Suganuma, K.¹ Sakai, T.² Kim, K.S.³ Takagi, Y.⁴ Sugimoto, J.⁵ Ueshima, M.⁶

11
- 0001417584
- 10.1007/s11664-997-0281-7 1:CAS:528:DyaK2sXlslams7Y%3D
- M. McCormack, H.S. Chen, G.W. Kammlott, S. Jin, J. Electron. Mater. 26, 954 (1997)
- (1997) J. Electron. Mater. , vol.26 , pp. 954
- McCormack, M.¹ Chen, H.S.² Kammlott, G.W.³ Jin, S.⁴

12
- 84856976367
- 10.1007/s10854-011-0566-8 1:CAS:528:DC%2BC38Xjs1WltA%3D%3D
- J. Shen, C. Wu, S. Li, J. Mater. Sci. Mater. Electron. 23, 156 (2012)
- (2012) J. Mater. Sci. Mater. Electron. , vol.23 , pp. 156
- Shen, J.¹ Wu, C.² Li, S.³

13
- 84891582638
- 5 John Wiley & Sons New Jersey 10.1002/9780470602638
- M. Schlesinger, M. Paunovic, Modern Electroplating, 5th edn. (John Wiley & Sons, New Jersey, 2010)
- (2010) Modern Electroplating
- Schlesinger, M.¹ Paunovic, M.²

14
- 0008455882
- Chapman & Hall London
- A.C. Tan, Tin and Solder Plating in the Semiconductor Industry: A Technical Guide (Chapman & Hall, London, 1993)
- (1993) Tin and Solder Plating in the Semiconductor Industry: A Technical Guide
- Tan, A.C.¹

15
- 0035359706
- 10.1007/BF02665876 1:CAS:528:DC%2BD3MXksFCgtrs%3D
- T. Ishii, S. Aoyama, M. Tokumitsu, J. Electron. Mater. 30, L25 (2001)
- (2001) J. Electron. Mater. , vol.30 , pp. 25
- Ishii, T.¹ Aoyama, S.² Tokumitsu, M.³

16
- 33748557788
- 10.1109/TCAPT.2006.880506 1:CAS:528:DC%2BD28XhtVWksrfP
- S. Bonafede, A. Huffman, W.D. Palmer, IEEE Trans. Comp. Packag. Technol. 29, 604 (2006)
- (2006) IEEE Trans. Comp. Packag. Technol. , vol.29 , pp. 604
- Bonafede, S.¹ Huffman, A.² Palmer, W.D.³

17
- 0035493763
- 10.1109/6104.980036 1:CAS:528:DC%2BD38XhsVWmsrc%3D
- H. Ezawa, M. Miyata, S. Honma, H. Inoue, T. Tokuoka, J. Yoshioka, M. Tsujimura, IEEE Trans. Electron. Packag. Manuf. 24, 275 (2001)
- (2001) IEEE Trans. Electron. Packag. Manuf. , vol.24 , pp. 275
- Ezawa, H.¹ Miyata, M.² Honma, S.³ Inoue, H.⁴ Tokuoka, T.⁵ Yoshioka, J.⁶ Tsujimura, M.⁷

18
- 0842348842
- 10.1016/0026-0576(96)81870-8 1:CAS:528:DyaK28XlsVKrtA%3D%3D
- J. Katayama, K. Okuno, Met. Finish. 94, 12 (1996)
- (1996) Met. Finish. , vol.94 , pp. 12
- Katayama, J.¹ Okuno, K.²

19
- 79960893907
- 10.1007/s10853-010-4961-y 1:CAS:528:DC%2BC3cXhtlOhtL7K
- C.H. Yeh, L.S. Chang, B.B. Straumal, J. Mater. Sci. 46, 1557 (2011)
- (2011) J. Mater. Sci. , vol.46 , pp. 1557
- Yeh, C.H.¹ Chang, L.S.² Straumal, B.B.³

20
- 0036699289
- 10.2320/matertrans.43.1821
- J.W. Yoon, C.B. Lee, S.B. Jung, Mater. Trans. 43, 1821 (2002)
- (2002) Mater. Trans. , vol.43 , pp. 1821
- Yoon, J.W.¹ Lee, C.B.² Jung, S.B.³

21
- 72549095324
- 10.1007/s11664-009-0944-7 1:CAS:528:DC%2BD1MXhsV2jsbvN
- F. Guo, G.C. Xu, J. Sun, Z.D. Xia, Y.P. Lei, Y.W. Shi, X.Y. Li, J. Electron. Mater. 38, 2756 (2009)
- (2009) J. Electron. Mater. , vol.38 , pp. 2756
- Guo, F.¹ Xu, G.C.² Sun, J.³ Xia, Z.D.⁴ Lei, Y.P.⁵ Shi, Y.W.⁶ Li, X.Y.⁷

22
- 0002378591
- 10.1016/S0921-5107(98)00202-5
- Y.C. Chan, A.C.K. So, J.K.L. Lai, Mater. Sci. Eng. B 55, 5 (1998)
- (1998) Mater. Sci. Eng. B , vol.55 , pp. 5
- Chan, Y.C.¹ So, A.C.K.² Lai, J.K.L.³

23
- 0344752637
- 1:CAS:528:DyaG1cXhsVOl
- S.C. Britton, K. Bright, Metallurgia 56, 163 (1957)
- (1957) Metallurgia , vol.56 , pp. 163
- Britton, S.C.¹ Bright, K.²

24
- 21544478296
- 10.1209/0295-5075/19/1/006 1:CAS:528:DyaK38XktlKqsLo%3D
- B.G. Orr, D. Kessler, C.W. Snyder, L. Sande, Europhys. Lett. 19, 33 (1992)
- (1992) Europhys. Lett. , vol.19 , pp. 33
- Orr, B.G.¹ Kessler, D.² Snyder, C.W.³ Sande, L.⁴

25
- 0942266970
- 10.1007/s11664-003-0108-0 1:CAS:528:DC%2BD2cXlsVyquw%3D%3D
- X. Deng, G. Piotrowski, J.J. Williams, N. Chawla, J. Electron. Mater. 32, 1403 (2003)
- (2003) J. Electron. Mater. , vol.32 , pp. 1403
- Deng, X.¹ Piotrowski, G.² Williams, J.J.³ Chawla, N.⁴

26
- 0031145428
- 10.1109/96.575568 1:CAS:528:DyaK2sXjtlyit7s%3D
- A.C.K. So, Y.C. Chan, J.K.L. Lai, IEEE Trans. Compon. Packag. Manuf. Technol. B 20, 161 (1997)
- (1997) IEEE Trans. Compon. Packag. Manuf. Technol. B , vol.20 , pp. 161
- So, A.C.K.¹ Chan, Y.C.² Lai, J.K.L.³

27
- 0026853573
- 10.1007/BF02651848
- M.D. Saban, J.D. Scott, R.M. Cassidy, Metall. Trans. B 23, 125 (1992)
- (1992) Metall. Trans. B , vol.23 , pp. 125
- Saban, M.D.¹ Scott, J.D.² Cassidy, R.M.³

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