Solder–Graphite Network Composite Sheets as High-Performance Thermal Interface Materials

Journal of Electronic Materials

Volumn 44, Issue 3, 2015, Pages 929-947

  Sharma, Munish ^a   Chung, D D L ^a  

^a UNIVERSITY AT BUFFALO   (United States)

Author keywords

exfoliated graphite; network; solder; thermal contact; Thermal interface material; tin

Indexed keywords

COPPER; COPPER ALLOYS; ELECTRONIC EQUIPMENT; GRAPHITE; HOT PRESSING; INTERFACES (MATERIALS); LEAD ALLOYS; MIXTURES; NETWORKS (CIRCUITS); OZONE; SILVER ALLOYS; SOLDERING; TERNARY ALLOYS; THALLIUM ALLOYS; THERMAL EXPANSION; THERMAL INSULATING MATERIALS; TIN; TIN ALLOYS;

COMPOSITE FABRICATION; ELECTRICAL CONDUCTIVITY; EXFOLIATED GRAPHITE; NETWORK CONNECTIVITY; THERMAL CONTACT; THERMAL CONTACT CONDUCTANCE; THERMAL EXPANSION COEFFICIENTS; THERMAL INTERFACE MATERIALS;

THERMAL CONDUCTIVITY;

EID: 84925521496     PISSN: 03615235     EISSN: 1543186X     Source Type: Journal    
DOI: 10.1007/s11664-014-3589-0     Document Type: Article

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