Thermal characterization of eutectic alloy thermal interface materials with void-like inclusions

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn 20, Issue , 2004, Pages 98-103

  Hu, Xuejiao ^a   Jiang, Linan ^a   Goodson, Kenneth E ^a  

^a Stanford University   (United States)

Author keywords

Solder die attach; Thermal contact resistance; Through wafer infrared microscopy; Void formation and growth

Indexed keywords

SOLDER DIE-ATTACH; THERMAL CONTACT RESISTANCE; THROUGH-WAFER INFRARED MICROSCOPY; VOID FORMATION AND GROWTH;

ELECTRONIC EQUIPMENT; FINITE ELEMENT METHOD; HEAT CONDUCTION; HEAT RESISTANCE; INCLUSIONS; SILICON; SOLDERING ALLOYS; STRAIN; THERMAL CONDUCTIVITY; THERMAL CYCLING; THERMAL EFFECTS; THERMODYNAMICS; VLSI CIRCUITS; X RAY ANALYSIS;

EUTECTICS;

EID: 2342598921     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (22)

1. Chung, D. D. L., "Thermal Interface Materials," Journal of Materials Engineering and Performance, Vol. 10, No. 1, pp. 56-59, 2001.
2. Zhu, N., "Thermal Impact of Solder Voids in the Electronic Packaging of Power Devices," Proc of 15th IEEE Semiconductor Thermal Measurement & Management Symp, pp. 22-29, 1999
3. Brown, E. R., Shaw, M. C., "Thermomechatronics of Power Electronic Packages," Proc of IEEE Intersociaty Conf on Thermal & Thermomechanical Phynomina in Electronic System, Vol. 2, pp. 270-278, 2000.
4. Katsis, D. C.; van Wyk, J. D., "Experimental Measurement and Simulation of Thermal Performance Due to Aging in Power Semiconductor Devices," Proc of IEEE Industry Applications Society Annual Meeting, Vol. 3, pp. 1746-1751, 2002.
5. Ciampolini, L., Regli, P., Fichtner, W., "Simulating Thermal Effects of Solder Voids in Large Area Joints," Proc of 4th Int Workshop on Thermal Investigations of ICs & Microstructures, pp. 179-183, 1998.
6. Ciampolini, L., Ciappa, M., Malberti, P., Regli, P., Fichtner, W., "Modelling Thermal Effects of Large Contiguous Voids in Solder Joints," Microelectronics Journal, Vol.30, No.11, pp.1115-1123, 1999.
7. Katsis, D. C.; VanWyk, J. D., "A Finite Element Modeling of Dynamic Hot Spot Effects in MOSFET Dies Due to Voiding in The Solder Die-attach," Proc of IEEE Power Electronics Specialist Conf, Vol. 2, pp.828-833, 2003.
8. Davis, J. R., "Nondestructive Evaluation and Quality Control," ASM Int Metals Handbook, 9th ed., Vol. 17, pp. 465-482, 1989.
9. Haque, S., Lu, G. Q., Goings, J., Sigmund, J., "Characterization of Interfacial Thermal Resistance by Acoustic Micrography Imaging," Microelectronics Reliability, Vol.40, No.3, pp.465-476, 2000.
10. Olson, B., Cholewczynski, M., "Measurement of Large Solder Voids Using X-Ray Image Analysis," Proc of SMTA International, pp. 550-555, 2000.
11. Rencz, M., Szekely, V., Morelli, A., Villa, C., "Determining Partial Thermal Resistances with Transient Measurements, and Using the Method to Detect Die Attach Discontinuities," Proc of 18th IEEE Semiconductor Thermal Measurement & Management Symp, pp. 15-20, 2002.
12. Chiu, C. P., Maveety, J. G., Tran, Q. A., "Characterization of Solder Interfaces Using Laser Flash Metrology," Microelectronics Reliability, Vol.42, No.1, pp. 93-100, 2002.
13. Kurabayashi, K., Goodson, K. E., "Precision Measurement and Mapping of Die-attach Thermal Resistance," IEEE Trans on Components, Packaging, & Manufacturing Technology - Part A, Vol.21, No.3, pp.506-514, 1998.
14. Christofferson, J., Shakouri, A., "Through the Substrate, Backside Thermal Measurements on Active Semiconductor Devices Using Near IR Thermoreflectance," Proc of 19th IEEE Semiconductor Thermal Measurement & Management Symp, pp. 271-275, 2003.
15. Kiefer, S., Nair, M., Sanders, P., Steele, J., Sutton, M., Thoma, R., Wilson, S., Albright, G., Li, C., McDonald, J., "Infrared Microthermography for Integrated Circuit Fault Location; Sensitivity And Limitations," Proc of 28th Int Symp for Testing and Failure Analysis, pp. 163-168, 2002
16. Hefner, A., Berning, D., Blackburn, D., Chapuy, C., Bouche, S., "A High-speed Thermal Image System for Semiconductor Device Analysis," Proc of 17th IEEE Semiconductor Thermal Measurement & Management Symp, pp.43-49, 2001.
17. Zhou, P., Goodson, K. E., "Modeling and Measurement of Pressure-dependent Junction-spreader Thermal Resistance for Integrated Circuits," Proc of ASME Int Mechanical Engineering Congress & Exposition, HTD-Vol. 369-7, pp. 51-67, 2001.
18. Runyan, W. R., Technology Semiconductor Silicon, McGrow-Hill, (New York, 1965), pp. 201
19. Siegman, A. E., Lasers, University Science Books, (Mill Valley, 1986), pp. 413-419.
20. Incropera, F. P., Dewitt, D. P., Introdution to Heat Transfer, John Wiley & Sons, (New York, 1996), pp.79-81
21. Remsburg, R., Thermal Design of Electronic Equipment, CRC Press LLC, (Boca Raton, 2001), pp. 74-78
22. Trujillo, D. M., Pappoff, C. G., "A General Thermal Contact Resistance Finite Element," Finite Elements in Analysis and Design,Vol.38, No.3, pp.263-76, 2002.