Carbon-black thixotropic thermal pastes for improving thermal contacts

Journal of Electronic Materials

Volumn 34, Issue 10, 2005, Pages 1336-1341

  Leong, Chia Ken ^a   Aoyagi, Yasuhiro ^a   Chung, D D L ^a  

^a UNIVERSITY AT BUFFALO   (United States)

Author keywords

Boron nitride (BN); Carbon black; Graphite; Polyethylene glycol (PEG); Polyol ester; Thermal contact; Thermal paste; Thixotropic

Indexed keywords

BORON COMPOUNDS; COPPER; GRAPHITE; MICROELECTRONICS; POLYETHYLENE GLYCOLS; SURFACE ROUGHNESS; THERMAL CONDUCTIVITY;

POLYOL ESTERS; POLYOL ETHERS; THERMAL CONTACT; THIXOTROPIC THERMAL PASTES;

CARBON BLACK;

EID: 27144484165     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-005-0259-2     Document Type: Article

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