Nanoclay paste as a thermal interface material for smooth surfaces

Journal of Electronic Materials

Volumn 37, Issue 11, 2008, Pages 1698-1709

  Lin, Chuangang ^a   Chung, D D L ^a  

^a UNIVERSITY AT BUFFALO   (United States)

Author keywords

Exfoliated clay; Nanoclay; Polyol ester; Thermal conductance; Thermal contact; Thermal interface material; Thermal paste

Indexed keywords

EXFOLIATED CLAY; NANOCLAY; POLYOL ESTER; THERMAL CONDUCTANCE; THERMAL CONTACT; THERMAL INTERFACE MATERIAL; THERMAL PASTE;

AMMONIUM COMPOUNDS; CLAY MINERALS; COPPER; ESTERS; FATIGUE OF MATERIALS; JOINTS (STRUCTURAL COMPONENTS); NANOCOMPOSITES; ORGANIC COMPOUNDS; SILICATE MINERALS; THERMAL INSULATING MATERIALS;

NANOSTRUCTURED MATERIALS;

EID: 53149152196     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-008-0538-9     Document Type: Article

References (41)

1. E.G. Wolff D.A. Schneider 1998 Int. J. Heat Mass Tranfer. 41 3469 10.1016/S0017-9310(98)00067-2
2. T. Ouellette and M. de Sorgo, Proc. Power Electron. Des. Conf. (Power Sources Users Conference, Cerritos, CA, 1985), p. 134.
3. M.R. Vogel, Proc. Int. Intersociety Electron. Packag. Conf., Vol. 10-2 (New York, NY: American Society of Mechanical Engineers, 1995), p. 989.
4. V. Sartre M. Lallemand 2001 Appl. Therm. Eng. 21 221 10.1016/S1359- 4311(00)00034-X
5. M. Grujicic C.L. Zhao E.C. Dusel 2005 Appl. Surf. Sci. 246 290 10.1016/j.apsusc.2004.11.030
6. D.D.L. Chung, J. Mater. Eng. Perform. 10, 56 (2001). doi: 10.1361/105994901770345358.
7. D.D.L. Chung 2006 Adv. Microelectron. 33 8
8. L. Maguire M. Behnia G.L. Morrison 2005 Microelectron. Reliab. 45 711 10.1016/j.microrel.2004.10.030
9. Y. Xu X. Luo D.D.L. Chung 2002 J. Electron. Packag. 124 188 10.1115/1.1477191
10. C.-K. Leong D.D.L. Chung 2003 Carbon 41 2459 10.1016/S0008-6223(03)00247- 1
11. C.-K. Leong D.D.L. Chung 2004 Carbon 42 2323 10.1016/j.carbon.2004.05.013
12. C.-K. Leong Y. Aoyagi D.D.L. Chung 2005 J. Electron. Mater. 34 1336 10.1007/s11664-005-0259-2
13. C.-K. Leong Y. Aoyagi D.D.L. Chung 2006 Carbon 44 435 10.1016/j.carbon.2005.09.002
14. T.A. Howe C.-K. Leong D.D.L. Chung 2006 J. Electron. Mater. 35 1628 10.1007/s11664-006-0209-7
15. C. Lin and D.D.L. Chung, Carbon (in press).
16. Y. Xu C.-K. Leong D.D.L. Chung 2007 J. Electron. Mater. 36 1181 10.1007/s11664-007-0188-3
17. C. Lin D.D.L. Chung 2007 J. Mater. Sci. 42 9245 10.1007/s10853-007-1911-4
18. Y. Aoyagi D.D.L. Chung 2007 J. Mater. Sci. 42 2358 10.1007/s10853-007- 1600-3
19. C. Lin T.A. Howe D.D.L. Chung 2007 J. Electron. Mater. 36 659 10.1007/s11664-007-0116-6
20. A. Yu P. Ramesh M.E. Itkis E. Bekyarova R.C. Haddon 2007 J. Phys. Chem. C 111 7565 10.1021/jp071761s
21. S. Mohanty S.K. Nayak 2007 Polym. Compos. 28 153 10.1002/pc.20284
22. M. McAlpine N.E. Hudson J.J. Liggat R.A. Pethrick D. Pugh I. Rhoney 2006 J. Appl. Polym. Sci. 99 2614 10.1002/app.22582
23. H. Xia M. Song 2006 Polym. Int. 55 229 10.1002/pi.1948
24. R. Krishnamoorthi and R.A. Vaia, eds., Polymer Nanocomposites: Synthesis, Characterization, and Modeling (Washington DC: American Chemical Society, 2002), Distributed by Oxford University Press
25. E. Chen 2004 Br. Ceram. Trans. 103 241 10.1179/096797804X4592
26. J.C. Matayabas Jr. and P.A. Koning, U.S. patent 6,924,027 (2005).
27. J. Matayabas Jr., PCT Int. Appl. WO 2005031864 (2005).
28. D. Burgentzlé J. Duchet J.F.A. Gérard A. Jupinb B. Fillon 2004 J. Colloid Interface Sci. 278 26 10.1016/j.jcis.2004. 05.015
29. V.E. Yudina G.M. Divouxb J.U. Otaigbeb V.M. Svetlichnyi 2005 Polymer (Guildf.) 46 10866 10.1016/j.polymer.2005.08.087
30. T.T. Chasteka A. Steina C. Macosko 2005 Polymer (Guildf.) 46 4431 10.1016/j.polymer.2005.02.062
31. D. Burgentzlé J. Duchet J.F. Gérard A. Jupin B. Fillon 2004 J. Colloid Interface Sci. 278 26 10.1016/j.jcis.2004.05.015
32. A.S.T.M. Standard, D 2196, Standard Test Methods for Rheological Properties of Non-Newtonian Materials by Rotational (Brookfield Type) Viscometer.
33. R.G. de Kretser P.J. Scales D.V. Boger 1998 Colloids Surf. 137 307 10.1016/S0927-7757(97)00372-5
34. A.R. Horrocks J. Mwila M. Miraftab M. Liu S.S. Chohan 1999 Polym. Degrad. Stabil. 65 25 10.1016/S0141-3910(98)00213-4
35. http://www.reade.com/Products/Carbons/Carbon-Black.html.
36. L.C. Sima S.R. Ramanana H. Ismaila K.N. Seetharamub T.J. Gohc 2005 Thermochim. Acta 430 155 10.1016/j.tca.2004.12.024
37. W.M. Rohsenow, J.P. Hartnett, and Y.I. Cho, Handbook of Heat Transfer, 3rd ed. (McGraw-Hill Companies, Inc., 1998), p. 2.67.
38. H. Huang C. Liu Y. Wu S. Fan 2005 Adv. Mater. 17 1652 10.1002/adma.200500467
39. P.K. Schelling L. Shi K.E. Goodson 2005 Mater. Today 8 30 10.1016/S1369-7021(05)70935-4
40. http://www.nanoclay.com/selection_chart.asp.
41. 41. R.G. Larson (1998) The Structure and Rheology of Complex Fluids (Topics in Chemical Engineering). Oxford University Press, USA, pp. 324-55