Electrothermal Characterization of Multilevel Cu-Graphene Heterogeneous Interconnects in the Presence of an Electrostatic Discharge (ESD)

IEEE Transactions on Nanotechnology

Volumn 14, Issue 2, 2015, Pages 205-209

  Zhang, Rui ^a   Zhao, Wen Sheng ^b   Hu, Jun ^a   Yin, Wen Yan ^a  

^a ZHEJIANG UNIVERSITY   (China)

^b HANGZHOU DIANZI UNIVERSITY   (China)

Author keywords

Electrostatic discharge (ESD); electrothermal analysis; heterogeneous interconnects; multilayer graphene (MLG); TD FEM

Indexed keywords

CMOS INTEGRATED CIRCUITS; ELECTROSTATIC DEVICES; ELECTROSTATIC DISCHARGE; ELECTROSTATICS; FINITE ELEMENT METHOD; GRAPHENE; MULTILAYERS; TIME DOMAIN ANALYSIS;

ADVANCED CMOS; ELECTROTHERMAL ANALYSIS; ELECTROTHERMAL CHARACTERIZATION; MAXIMUM TEMPERATURE; MULTI LEVEL INTERCONNECTS; MULTILAYER GRAPHENE; TEMPERATURE RESPONSE; TIME-DOMAIN FINITE ELEMENT METHODS;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 84925280651     PISSN: 1536125X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TNANO.2014.2381775     Document Type: Article

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