On the relevance of IC ESD performance to product quality

Electrical Overstress/Electrostatic Discharge Symposium Proceedings

Volumn , Issue , 2008, Pages 14-20

  Smedes, T ^a   Christoforou, Y ^a  

^a NXP SEMICONDUCTORS   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

APPLICATION SPECIFIC; ESD PERFORMANCE; ESD STRESS; PRODUCT QUALITY; PRODUCT TYPES;

ELECTROSTATIC DEVICES; ELECTROSTATIC DISCHARGE;

QUALITY CONTROL;

EID: 66749105309     PISSN: 07395159     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. Industry council on ESD Targets, 'A Case for Lowering Component Level HBM/MM ESD Specifications and Requirements', White Paper, 2007, http://www.esdforum.de/ (news) or http://esdtargets.blogspot.com/ or http://www.esda.org/.
2. AEC, 'Zero Defects Guideline', AEC-Q004, draft, August 2006.
3. M. Kelly et al., 'A Comparison of Electrostatic Discharge Models and Failure Signatures for CMOS Integrated Circuit Devices', Proceedings EOS/ESD Symposium, pp. 175-185, 1995.
4. L. Fang, M. Lemnawar and Y. Xing, 'Cost Effective Outliers Screening with Moving Limits and Correlation Testing for Analogue ICs', Proceedings ITC, pp. 1-10, 2006.
5. IEC, 'Integrated circuits - EMC evaluation of CAN transceivers', IEC TS 62228, 2007
6. F. Kuper et al., 'Relation Between Yield and Reliability of Integrated Circuits: Experimental Results and Application to Continuous Early Failure Rate Reduction programs', Proceedings IRPS, pp.17-21, 1996.
7. R. Gaertner, 'Do We Expect ESD-failures in an EPA Designed According to International Standards?- The Need for a Process Related Risk Analysis', Proceedings EOS/ESD Symposium, pp. 192-197, 2007.
8. IEC, 'EMC evaluation of CAN transceivers -EMC evaluation of CAN transceivers - EMC evaluation of CAN transceivers', IEC 61000-4-2, 1996