Etching of silicon surfaces using atmospheric plasma jets

Plasma Sources Science and Technology

Volumn 24, Issue 2, 2015, Pages

  Paetzelt, H ^a   Bohm G ^a   Arnold, Th ^a  

^a LEIBNIZ INSTITUTE OF SURFACE ENGINEERING IOM   (Germany)

Author keywords

plasma etching; plasma jet machining; surface roughness

Indexed keywords

ATMOSPHERIC CHEMISTRY; ATMOSPHERIC PRESSURE; ATOMIC FORCE MICROSCOPY; ERROR CORRECTION; MANUFACTURE; PLASMA ETCHING; SILICON; SILICON WAFERS; SURFACE ROUGHNESS;

ATMOSPHERIC PLASMAS; CRYSTALLINE SILICONS; JET MACHINING; MANUFACTURING COMPLEX; MATERIAL REMOVAL RATE; SILICON STRUCTURES; SURFACE PROCESSING; WHITE-LIGHT INTERFEROMETRY;

PLASMA JETS;

EID: 84924340596     PISSN: 09630252     EISSN: 13616595     Source Type: Journal    
DOI: 10.1088/0963-0252/24/2/025002     Document Type: Article

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