Warping of silicon wafers subjected to back-grinding process

Precision Engineering

Volumn 40, Issue , 2015, Pages 87-93

  Gao, Shang ^a   Dong, Zhigang ^a   Kang, Renke ^a   Zhang, Bi ^a,b   Guo, Dongming ^a  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

^b UNIVERSITY OF CONNECTICUT   (United States)

Author keywords

Grinding; Silicon wafer; Stress; Thinning; Warping

Indexed keywords

GRINDING (MACHINING); MONOCRYSTALLINE SILICON; STRESSES;

ELASTICITY THEORY; GRINDING CONDITIONS; GRINDING PROCESS; MACHINING STRESS; THINNING; THINNING PROCESS; ULTRAPRECISION GRINDING; WARPING;

SILICON WAFERS;

EID: 84922843168     PISSN: 01416359     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.precisioneng.2014.10.009     Document Type: Article

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