Drawbacks of the nanoparticle reinforced lead-free BGA solder joints

ESTC 2014 - 5th Electronics System-Integration Technology Conference

Volumn , Issue , 2014, Pages

  Sun, Huayu ^a   Chan, Y C ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

BALL GRID ARRAYS; BINARY ALLOYS; BISMUTH ALLOYS; CESIUM ALLOYS; NANOPARTICLES; REINFORCEMENT; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING; TERNARY ALLOYS; TIN ALLOYS;

BALL-SHEAR TEST; LEAD-FREE BGA; MECHANICAL ADVANTAGE; MECHANICAL STIRRING; QUANTITATIVE EXPERIMENTS; SOLDER FLUXES; SOLDER JOINTS; SOLDER PASTE;

LEAD-FREE SOLDERS;

EID: 84918581923     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2014.6962816     Document Type: Conference Paper

References (13)

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