Roll-to-roll atomic layer deposition process for flexible electronics encapsulation applications

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 32, Issue 5, 2014, Pages

  Maydannik, Philipp S ^a,e   Kääriäinen, Tommi O ^a,d   Lahtinen, Kimmo ^a   Cameron, David C ^a   Söderlund, Mikko ^b   Soininen, Pekka ^b   Johansson, Petri ^c   Kuusipalo, Jurkka ^c   Moro, Lorenza ^d   Zeng, Xianghui ^d  

^a LAPPEENRANTA UNIVERSITY OF TECHNOLOGY   (Finland)

^b Beneq Oy   (Finland)

^c TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

^d Samsung Cheil Industries San Jose RandD Center ^*  (Finland)

^e UNIVERSITY OF COLORADO   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEPOSITION; FILM GROWTH; FLEXIBLE DISPLAYS; FLEXIBLE ELECTRONICS; LIGHT EMITTING DIODES; OPTICAL DATA PROCESSING; SUBSTRATES;

DIFFUSION BARRIER LAYERS; ELECTRONICS ENCAPSULATION; FLEXIBLE ELECTRONIC DEVICES; FLEXIBLE ORGANIC LIGHT EMITTING DIODES; LIGHT EMITTING MATERIALS; POLYETHYLENE NAPHTHALATE; SUBSTRATE TEMPERATURE; WATER VAPOR TRANSMISSION RATE;

ATOMIC LAYER DEPOSITION;

EID: 84913577765     PISSN: 07342101     EISSN: 15208559     Source Type: Journal    
DOI: 10.1116/1.4893428     Document Type: Article

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