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Volumn 30, Issue 1, 2012, Pages
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Low temperature and roll-to-roll spatial atomic layer deposition for flexible electronics
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Author keywords
[No Author keywords available]
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Indexed keywords
CRITICAL PARAMETER;
FLEXIBLE SUBSTRATE;
HIGH-THROUGHPUT;
LOW TEMPERATURE PROCESSING;
LOW TEMPERATURES;
MANUFACTURING TECHNIQUES;
PROCESS CONDITION;
ROLL TO ROLL;
THIN-FILM DEPOSITIONS;
TRIMETHYL ALUMINUMS;
WATER PARTIAL PRESSURE;
ALUMINA;
ALUMINUM COATINGS;
ATOMIC LAYER DEPOSITION;
ATOMS;
DEPOSITION;
FLEXIBLE MANUFACTURING SYSTEMS;
FLEXIBLE ELECTRONICS;
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EID: 84855612491
PISSN: 07342101
EISSN: None
Source Type: Journal
DOI: 10.1116/1.3667113 Document Type: Article |
Times cited : (75)
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References (12)
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