Low temperature consolidation of micro/nanosilver die-attach preforms

Journal of Electronic Materials

Volumn 43, Issue 9, 2014, Pages 3379-3388

  McCoppin, Jared ^a   Reitz, Thomas L ^b   Miller, Ryan ^b   Vijwani, Hema ^a   Mukhopadhyay, Sharmila ^a   Young, Daniel ^a  

^a Wright State University   (United States)

^b Energy/Power/Thermal Division   (United States)

Author keywords

bonding; Low temperature sintering; metallic tape casting; nanoparticles; silver nanostructures

Indexed keywords

BONDING; MATERIALS PROPERTIES; MIXTURES; NANOPARTICLES; PRESTRESSING; SHRINKAGE; SILVER; SINTERING; TEMPERATURE;

HIGH-TEMPERATURE POWER; LARGE-AREA ELECTRONICS; LOW TEMPERATURE CONSOLIDATION; LOW-TEMPERATURE SINTERING; METALLIC TAPES; POLYPROPYLENE CARBONATE; SILVER NANOSTRUCTURES; UNI-AXIAL COMPRESSION;

DIES;

EID: 84906322850     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-014-3257-4     Document Type: Article

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