The strength of high-temperature ag-in joints produced between copper by fluxless low-temperature processes

Journal of Electronic Packaging

Volumn 136, Issue 1, 2014, Pages

  Wu, Yuan Yun ^a   Lee, Chin C ^a  

^a University of California at Irvine   (United States)

Author keywords

High temperature electronics; Indium; Silver; Silver solid solution; Sliver indium alloys

Indexed keywords

BINARY ALLOYS; BRITTLE FRACTURE; COPPER; COPPER ALLOYS; DUCTILE FRACTURE; INDIUM; INDIUM ALLOYS; INDIUM COMPOUNDS; SCANNING ELECTRON MICROSCOPY; SILVER ALLOYS; SUBSTRATES; TEMPERATURE;

CU SUBSTRATE; DUCTILE-MODE; FIRST DESIGNS; FLUXLESS; HIGH-TEMPERATURE ELECTRONICS; HIGHEST TEMPERATURE; LOW- TEMPERATURE PROCESS; SHEAR TESTS; SILVER SOLID SOLUTION; SLIVER-INDIUM ALLOY;

SOLID SOLUTIONS;

EID: 84903772191     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.4026171     Document Type: Article

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