Growth and strength of the solid solution phase (Ag) with indium

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2013, Pages 1783-1787

  Wu, Yuan Yun ^a   Lee, Chin C ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING PROCESS; CONTINUOUS REACTIONS; CONVERTING PROCESS; ENERGY DISPERSIVE X RAY SPECTROSCOPY; FLUXLESS BONDING; INNOVATIVE DESIGN; SOLID SOLUTION PHASE; SYSTEMATIC EXPERIMENT;

ALLOYS; DESIGN; INDIUM; MELTING POINT; SCANNING ELECTRON MICROSCOPY; SILVER; SOLID SOLUTIONS; SUBSTRATES; X RAY SPECTROSCOPY;

SILVER ALLOYS;

EID: 84883435092     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2013.6575817     Document Type: Conference Paper

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