SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 38, Issue 9, 2009, Pages 1860-1865

Intermetallic reaction of indium and silver in an electroplating process

(3) Wang, Pin J a Kim, Jong S a Lee, Chin C a

a UNIVERSITY OF CALIFORNIA (United States)

Author keywords

AgIn 2; Electroplating; Indium; Intermetallic reaction; Silver

Indexed keywords

AGIN 2; CROSS SECTION; ELECTROPLATING PROCESS; ENERGY DISPERSIVE X-RAY SPECTROSCOPY; INDIUM ATOMS; INTERMETALLIC COMPOUNDS; INTERMETALLIC REACTION; LOW MELTING TEMPERATURES; LOW-YIELD-STRENGTHS; PHASE IDENTIFICATION; PLATING PROCESS; ROOM TEMPERATURE; SEM; SILVER LAYER; STORAGE TIME; X-RAY DIFFRACTION METHOD; XRD;

ATOMS; CHEMICAL REACTIONS; ELECTROCHEMICAL ELECTRODES; ELECTRONICS INDUSTRY; ELECTROPLATING; INDIUM; INTERMETALLICS; MELTING POINT; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING INDIUM COMPOUNDS; X RAY DIFFRACTION; X RAY DIFFRACTION ANALYSIS;

SILVER;

EID: 68949150938 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-009-0845-9 Document Type: Article

Times cited : (30)

References (13)

1
- 84864157381
- http://www.yutopian.com/Yuan/prop/In.html.

2
- 0034478729
- S. Choe, W.W. So, and C.C. Lee, Proc. IEEE Electron. Compon. Technol. Conf. (2000), p. 114.
- (2000) Proc. IEEE Electron. Compon. Technol. Conf. , pp. 114
- Choe, S.¹ So, W.W.² Lee, C.C.³

3
- 0027599585
- 10.1109/33.232058
- C.C. Lee C.Y. Wang G. Matijasevic 1993 IEEE Trans. Compon. Hybr. Manuf. Technol. 16 311 10.1109/33.232058
- (1993) IEEE Trans. Compon. Hybr. Manuf. Technol. , vol.16 , pp. 311
- Lee, C.C.¹ Wang, C.Y.² Matijasevic, G.³

4
- 0031094262
- 10.1109/95.558543
- Y.-C. Chen W.W. So C.C. Lee 1997 IEEE Trans. Compon. Packag. Manuf. Technol. 20 46 10.1109/95.558543
- (1997) IEEE Trans. Compon. Packag. Manuf. Technol. , vol.20 , pp. 46
- Chen, Y.-C.¹ So, W.W.² Lee, C.C.³

5
- 0034188661
- High temperature silver-indium joints manufactured at low temperature
- DOI 10.1016/S0040-6090(00)00727-6
- C.C. Lee W.W. So 2000 Thin Solid Films 336 196 10.1016/S0040-6090(00) 00727-6 (Pubitemid 30867717)
- (2000) Thin Solid Films , vol.366 , Issue.1-2 , pp. 196-201
- Lee, C.C.¹ So, W.W.²

6
- 33747601389
- Optoelectronic and microwave transmission characteristics of indium solder bumps for low-temperature flip-chip applications
- DOI 10.1109/TADVP.2006.875417
- K.-M. Chu J.-H. Choi J.-S. Lee H.S. Cho S.-O. Park H.-H. Park D.Y. Jeon 2006 IEEE Trans. Adv. Packag. 29 409 10.1109/TADVP.2006.875417 (Pubitemid 44263681)
- (2006) IEEE Transactions on Advanced Packaging , vol.29 , Issue.3 , pp. 409-414
- Chu, K.-M.¹ Choi, J.-H.² Lee, J.-S.³ Cho, H.S.⁴ Park, S.-O.⁵ Park, H.-H.⁶ Jeon, D.Y.⁷

7
- 33845703257
- 10.1007/s10854-006-9013-7
- P.T. Vianco J.A. Rejent A.F. Fossum M.K. Neilsen 2007 J. Mater. Sci.: Mater. Electron. 18 93 10.1007/s10854-006-9013-7
- (2007) J. Mater. Sci.: Mater. Electron. , vol.18 , pp. 93
- Vianco, P.T.¹ Rejent, J.A.² Fossum, A.F.³ Neilsen, M.K.⁴

8
- 0003689862
- Metal Park, OH: ASM International
- H. Okamoto and T.B. Massalski, Binary Alloy Phase Diagrams (Metal Park, OH: ASM International, 1990), pp. 381-383.
- (1990) Binary Alloy Phase Diagrams , pp. 381-383
- Okamoto, H.¹ Massalski, T.B.²

9
- 0003427458
- Addison Wesley
- B.D. Cullity, Elements of X-ray Diffraction, 2nd ed. (Addison Wesley, 1978), p. 513.
- (1978) Elements of X-ray Diffraction, 2nd Ed. , pp. 513
- Cullity, B.D.¹

10
- 84864157382
- http://henke.lbl.gov/optical-constants/atten2.html.

11
- 0026116734
- 10.1016/0040-6090(91)90241-O
- R. Roy S.K. Ken 1991 Thin Solid Films 197 303 10.1016/0040-6090(91)90241- O
- (1991) Thin Solid Films , vol.197 , pp. 303
- Roy, R.¹ Ken, S.K.²

12
- 0018507042
- ROOM TEMPERATURE INTERACTIONS IN Ag-METALS THIN FILM COUPLES.
- DOI 10.1016/0040-6090(79)90457-7
- V. Simic Z. Marinkovic 1979 Thin Solid Films 61 149 10.1016/0040-6090(79) 90457-7 (Pubitemid 10420817)
- (1979) Thin Solid Films , vol.61 , Issue.2 , pp. 149-160
- Simic, V.¹ Marinkovic, Z.²

13
- 57349147113
- 10.1109/TCAPT.2008.2001195
- J.S. Kim P.J. Wang C.C. Lee 2008 IEEE Trans. Compon. Packag. Technol. 31 782 10.1109/TCAPT.2008.2001195
- (2008) IEEE Trans. Compon. Packag. Technol. , vol.31 , pp. 782
- Kim, J.S.¹ Wang, P.J.² Lee, C.C.³

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.