Determination of electrical contact resistivity in thermoelectric modules (TEMs) from module-level measurements

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 2, Issue 4, 2012, Pages 668-676

  Annapragada, S Ravi ^a   Salamon, Todd ^c   Kolodner, Paul ^c   Hodes, Marc ^b   Garimella, Suresh V ^d  

^a UNITED TECHNOLOGIES RESEARCH CENTER   (United States)

^b TUFTS UNIVERSITY   (United States)

^c LUCENT TECHNOLOGIES   (United States)

^d PURDUE UNIVERSITY   (United States)

Author keywords

Cooling; electrical contact resistance; thermoelectric module

Indexed keywords

BULK MATERIALS; ELECTRICAL CONDUCTIVITY; ELECTRICAL CONTACT RESISTANCE; ELECTRICAL CONTACTS; EXPERIMENTAL APPARATUS; PERFORMANCE SPECIFICATIONS; REFRIGERATION MODE; TEMPERATURE DEPENDENT; THERMOELECTRIC MODULES; THOMSON EFFECTS;

COOLING; ELECTRIC CONDUCTIVITY; EQUIVALENT CIRCUITS; EXPERIMENTS; PELTIER EFFECT;

ELECTRIC CONTACTS;

EID: 84859739781     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2012.2183595     Document Type: Article

References (23)

1. L. D. Hicks, T. C. Harman, X. Sun, and M. S. Dresselhaus, "Experimental study of the effect of quantum-well structures on the thermoelectric figure of merit," Phys. Rev. B, vol. 47, no. 19, pp. 12727-12731, 1996.
2. F. J. DiSalvo, "Thermoelectric cooling and power generation," Science, vol. 285, no. 5428, pp. 703-706, 1999.
3. M. Hodes, "Precision temperature control of an optical router," in Handbook of Heat Transfer Calculations. New York: McGraw-Hill, 2006.
4. Y. Makino and T. Maruyama, "Transient cooling of heat-generating materials with thermoelectric coolers," Chem. Eng. Technol., vol. 29, no. 6, pp. 711-715, 2006.
5. L. W. Silva and M. Kaviany, "Micro-thermoelectric cooler: Interfacial effects on thermal and electrical transport," Int. J. Heat Mass Trans., vol. 47, nos. 10-11, pp. 2417-2435, 2004.
6. H. Böttner, J. Nurnus, A. Gavrikov, G. Kühner, M. Jägle, C. Künzel, D. Eberhard, G. Plescher, A. Schubert, and K. Schlereth, "New thermoelectric components using microsystem technologies," J. Microelectromech. Syst., vol. 13, no. 3, pp. 414-420, Jun. 2004.
7. P. Wang and A. Bar-Cohen, "On-chip hot spot cooling using silicon thermoelectric microcoolers," J. Appl. Phys., vol. 102, no. 3, pp. 034503-1-034503-11, 2007.
8. C. Y. Chang, Y. K. Fang, and S. M. Sze, "Specific contact resistance of metal-semiconductor barriers," Solid-State Electron., vol. 14, no. 7, pp. 541-550, 1971.
9. I. Chowdhury, R. Prasher, K. Lofgreen, G. Chrysler, S. Narasimhan, R. Mahajan, D. Koester, R. Alley, and R. Venkatasubramanian, "Onchip cooling by superlattice-based thin-film thermoelectric," Nature Nanotechnol., vol. 4, pp. 235-238, Jan. 2009.
10. R. Singh and A. Shakouri, "Thermostat for high temperature and transient characterization of thin film thermoelectric materials," Rev. Sci. Instrum., vol. 80, no. 2, pp. 025101-1-025101-5, 2009.
11. S. Krishnan, S. V. Garimella, G. Chrysler, and R. Mahajan, "Toward a thermal Moore's Law," IEEE Trans. Adv. Packag., vol. 30, no. 3, pp. 462-474, Aug. 2007.
12. H. Mishra, B. A. Cola, V. Rawat, P. B. Amama, K. G. Biswas, X. Xu, T. S. Fisher, and T. D. Sands, "Thermomechanical and thermal contact characteristics of bismuth telluride films electrodeposited on carbon nanotube arrays," Adv. Mater., vol. 21, no. 42, pp. 4280-4283, 2009.
13. K. G. Biswas, T. D. Sands, B. A. Cola, and X. Xu, "Thermal conductivity of bismuth telluride nanowire array-epoxy composite," Appl. Phys. Lett., vol. 94, no. 22, pp. 223116-1-223116-3, 2009.
14. W. Shockley, "Research and investigation of inverse epitaxial UHF power transistors," Air Force Atomic Laboratory, Wright Patterson AFB, OH, Tech. Rep. A1-TOR-64-207, 1964.
15. H. H. Berger, "Models for contacts to planar devices," Solid State Electron., vol. 15, no. 2, pp. 145-158, 1972.
16. S. B. Schuldt, "An exact derivation of contact resistance to planar devices," Solid-State Electron., vol. 21, pp. 715-719, May 1978.
17. G. K. Reeves and H. B. Harrison, "Obtaining the specific contact resistance from transmission line model measurements," IEEE Electron Dev. Lett., vol. 3, no. 5, pp. 111-113, May 1982.
18. L. K. Makt, C. M. Rogersi, and D. C. Northrop, "Specific contact resistance measurements on semiconductors," J. Phys. E: Sci. Instru., vol. 22, no. 5, pp. 317-321, 1989.
19. ANSYS Icepak, Users Guide, Ansys Inc., Lebanon, NH, 2009.
20. ANSYS Fluent 6.3, User Defined Function Manual, Ansys Inc., Lebanon, NH, 2009.
21. Melcor Thermal Solutions, Melcor Corporation, Trenton, NJ, 2002.
22. M. Hodes, "Optimal pellet geometries for thermoelectric refrigeration," IEEE Trans. Compon. Packag. Technolog., vol. 30, no. 1, pp. 50-58, Mar. 2007.
23. M. Hodes, "Optimal design of thermoelectric refrigerators embedded in a thermal resistance network, (periodical style-submitted for publication)," IEEE Trans. Compon. Packag. Technol., to be published.