Sinter-attach of Peltier dice for cooling of deep-drilling electronics

2012 IEEE I2MTC - International Instrumentation and Measurement Technology Conference, Proceedings

Volumn , Issue , 2012, Pages 658-663

  Kahler J ^a   Stranz, A ^a   Waag, A ^a   Peiner, E ^a   Jung, S ^b   Kruspe, T ^b  

^a TECHNICAL UNIVERSITY OF BRAUNSCHWEIG   (Germany)

^b BAKER HUGHES   (United States)

Author keywords

adhesive strength; conductivity measurement; electrical resistance measurement; materials testing; semiconductor device testing

Indexed keywords

ADHESIVE STRENGTH; AG PARTICLES; BISMUTH TELLURIDE; CONDUCTIVITY MEASUREMENTS; ELECTRICAL CONDUCTIVITY; ELECTRICAL RESISTANCE MEASUREMENT; MEASUREMENT WHILE DRILLINGS; PELTIER; PELTIER COOLERS; SHEAR TESTS; THERMALLY INDUCED STRESS; THERMOELECTRIC MATERIAL; THERMOELECTRIC MODULES; YOUNG'S MODULUS;

ELECTRIC CONDUCTIVITY; ELECTRONIC COOLING; MATERIALS TESTING; SEMICONDUCTOR DEVICE TESTING; SILVER; SKUTTERUDITES; STRENGTH OF MATERIALS; THERMAL CONDUCTIVITY; THERMOELECTRICITY;

SINTERING;

EID: 84864204712     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/I2MTC.2012.6229481     Document Type: Conference Paper

References (25)

1. http://www.gebo-nds.de The Gebo research association. Accessed 7 May 2011.
2. http://www1.eere.energy.gov/geothermal/plans.htm. Geothermal technologies program: Multi-year research, development, and demonstration plan, US Department of Energy 2009.
3. J. H. Cohen, G. Deskins, W. Motion, J. Martin, "Development of a mudpulse high-temperature Measurement-While-Drilling (MWD) system", Final Report: DE-AC26-97FT34345, 2002 [http://www.osti.gov/bridge/servlets/purl/ 828406-9vCPaN/native/828406.pdf].
4. A. Sinha, Y. K. Joshi, "Downhole electronics cooling using a thermoelectric device and heat exchanger arrangement", J. Electron. Packag., Vol. 133 (4), 2011.
5. B. Plamp, "Development of a high pressure/high temperature down-hole turbine generator", Final report: DE-FC26-05NT42655, Office of Fossil Energy, United States Department of Energy, 2010.
6. B. C. Sales, B. C. Chakoumakos, and D. Mandrus, "Thermoelectric properties of thallium-filled skutterudites", Physical review B, Vol. 61, pp. 2475-2481, 2000.
7. W. P. Lin, C. C. Lee, "Fluxless bonding of Bismuth Telluride chips to alumina using Ag-In system for high temperature thermoelectric devices", IEEE Trans.s on CPMT, Vol. 1, Sep. 2011.
8. J. Kähler, N. Heuck, A. Stranz, A. Waag, E. Peiner, "Pick-and-Place silver sintering of small-area chips", IEEE Trans.s on CPMT, vol. 2, pp. 199-207, 2012.
9. C. Mertens, "Die Niedertemperatur-Verbindungstechnik der Leistungselektronik", PHD-Thesis (2004), Braunschweig.
10. N. Heuck, A. Langer, A. Stranz, G. Palm, R. Sittig, A. Bakin, A. Waag, "Analysis and modeling of thermomechanically improved silver-sintered die-attach layers modified by additives", IEEE Trans.s on CPMT, Vol. 1, pp. 1846-1855, Nov. 2011.
11. M. Kuramoto, S. Ogawa, M. Niwa, K. Keun-Soo, K. Suganuma, "New silver paste for die-attaching ceramic light-emitting diode packages", IEEE Trans.s on CPMT, Vol. 1, pp. 653-659, 2011.
12. J. Kähler, N. Heuck, G. Palm, A. Stranz, A. Waag, E. Peiner, "Lowpressure sintering of silver micro- and nanoparticles for a high temperature stable Pick & Place die attach", iMAPs Proc. of EMPC, Brighton, UK, September 12-15, 2011.
13. 2 for thermoelectric applications", Mat. Sc. Forum, Vols. 492-493, pp 273-280, 2005.
14. H. J. Goldschmid, "The thermal conductivity of Bismuth Telluride", Proc. Phys. Soc. B, vol. 69, p. 203, 1956.
15. 3 from 4.2 K to 600 K", Phy. Letters, Vol. 46 A, pp.317-318, Jan. 1974.
16. J. Kähler, A. Stranz, L. Doering, S. Merzsch, N. Heuck, A. Waag, E. Peiner, "Fabrication, packaging, and characterization of p-SOI Wheatstone bridges for harsh environments", Microsyst. Technol., online first, DOI: 10.1007/s00542-011-1396-6, 2011.
17. Test Method Standard Microcircuits, Standard MIL-STD-883H, Feb. 481 2010.
18. G. Ondracek, "On the relationship between the properties and the microstructure of multiphase materials. Part I: Microstructure and young's modulus of elasticity", Z. Werkstofft., Vol. 9, pp. 31-36, 1979.
19. A. Knobloch (General Electric Global Research), "Harsh-environment packaging for down-hole das and oil exploration", Final Report: DEFC26- 06NT42950, 2007 [http://www.netl.doe.gov/technologies/oilgas/publications/ EPreports/NT42950-FinalReport.pdf].
20. R. P. Gupta, J. B. White, O. D. Iyore, U. Chakrabarti, H. N. Alshareef, and B. E. Gnade, "Determination of contact resistivity by the Cox and Strack Method for metal contacts to bulk Bismuth Antimony Telluride", Electrochem. Solid-State Lett., vol. 12, pp. H302-H304, 2009.
21. L. W. da Silva, M. Kaviany, "Micro-thermoelectric cooler: interfacial effects on thermal and electrical transport", Int. Journal of Heat and Mass Transfer, Vol. 47, pp. 2417-2435, 2004.
22. C.-H. Liao, C.-H. Lee, W.-J. Chen, "Effect of interfacial compound formation on contact resistivity of soldered junctions between Bismuth Telluride-based thermoelements and copper", Electrochemical and Solid-State Letters, Vol. 10, pp. 23-25, 2007.
23. th Int. Conf. on Thermoelectrics (ICT), Vienna, Austria, August 6-10, 2006.
24. G. S Nolas, J. Sharp, H. J. Goldsmid, "Thermoelectrics-basic principles and new materials development", Springer, 2001.
25. S. V. Kidalov, F. M. Shakhov, "Thermal conductivity of diamond composites", Materials, Vol. 2, pp. 2467-2495, 2009.