Analytical and numerical parameter extraction for compact modeling of thermoelectric coolers

International Journal of Heat and Mass Transfer

Volumn 60, Issue 1, 2013, Pages 689-699

  Chen, Min ^a   Snyder, G Jeffrey ^b  

^a AALBORG UNIVERSITY   (Denmark)

^b California Institute of Technology   (United States)

Author keywords

CFD; Compact modeling; Peltier effect; Thermal management; Thermoelectric cooler

Indexed keywords

AIR-COOLED HEAT SINKS; BLACK BOXES; CFD APPROACHES; COMPACT MODEL; COMPACT MODELING; COMPUTATION TIME; DATA SHEETS; EFFECTIVE MATERIAL PROPERTY; MULTISCALES; PHYSICAL MODEL; SYSTEM LEVELS; THERMAL MANAGEMENT APPLICATIONS; THERMAL SYSTEMS; THERMOELECTRIC COOLER; VIRTUAL EXPERIMENTS;

COMPUTATIONAL FLUID DYNAMICS; COOLING SYSTEMS; PARAMETER EXTRACTION; PELTIER EFFECT; TEMPERATURE CONTROL; THERMOELECTRIC REFRIGERATION; VIRTUAL REALITY;

THERMOELECTRIC EQUIPMENT;

EID: 84873962484     PISSN: 00179310     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijheatmasstransfer.2013.01.020     Document Type: Article

References (32)

1. G.J. Snyder, J.-P. Fleurial, R-G. Yang, T. Caillat, and G. Chen Supercooling of Peltier cooler using a current pulse J. Appl. Phys. 92 2002 1564 (Pubitemid 34924392)
2. R.E. Simons, M.J. Ellsworth, and C. Chu An assessment of module cooling enhancement with thermoelectric coolers ASME J. Heat Transfer 127 2005 76 84 (Pubitemid 40383011)
3. K. Yazawa, G.L. Solbrekken, and A. Bar-Cohen Thermoelectric-powered convective cooling of microprocessors IEEE Trans. Adv. Packag. 28 2005 231 239 (Pubitemid 40784534)
4. R.A. Khire, A. Messac, and S.V. Dessel Design of thermoelectric heat pump unit for active building envelope systems Int. J. Heat Mass Transfer 48 2005 4028 4040 (Pubitemid 41019584)
5. R.A. Taylor, and G.L. Solbrekken Comprehensive system-level optimization of thermoelectric devices for electronic cooling applications IEEE Trans. Compon. Packag. Technol. 31 2008 23 31 (Pubitemid 351447594)
6. A. Sinha, and Y. Joshi Application of thermoelectric-adsorption cooler for harsh environment electronics under varying heat load ASME J. Therm. Sci. Eng. Appl. 2 2009 021004
7. P. Naphon, and S. Wiriyasart Liquid cooling in the mini-rectangular fin heat sink with and without thermoelectric for CPU Int. Commun. Heat Mass Transfer 36 2009 166 171
8. H. Huang, Y. Weng, Y. Chang, S. Chen, and M. Ke Thermoelectric water-cooling device applied to electronic equipment Int. Commun. Heat Mass Transfer 37 2010 140 146
9. E. Elena, D.C. Looman, Finite elements for thermoelectric device analysis in ANSYS, in: Proceedings of 24th International Conference on Thermoelectrics, Clemson, USA, 2005, pp. 200-203. (Pubitemid 44250080)
10. K.H. Lee, and O.J. Kim Analysis on the cooling performance of the thermoelectric micro-cooler Int. J. Heat Mass Transfer 50 2007 1982 1992
11. C. Cheng, S. Huang, and T. Cheng A three-dimensional theoretical model for predicting transient thermal behavior of thermoelectric coolers Int. J. Heat Mass Transfer 53 2010 2001 2011
12. J. Pérez-Aparicio, R. Palma, and R. Taylor Finite element analysis and material sensitivity of Peltier thermoelectric cells coolers Int. J. Heat Mass Transfer 55 2012 1363 1374
13. Junior, G. Chen, and J. Koehler Modeling of a new recuperative thermoelectric cycle for a tumble dryer Int. J. Heat Mass Transfer 55 2012 1536 1543
14. M.P. Codecasa, E. Colombo, F. Inzoli, G. Pastorino, C. Rizzo, Optimization of a new thermoelectric cooling assembly using CFD analysis and local modeling of thermoelectric effects, in: Proceedings of 22nd International Conference on Thermoelectrics, Herault, France, 2003, pp. 614-618.
15. M. Chen, L.A. Rosendahl, and T. Condra A three-dimensional numerical model of thermoelectric generators in fluid power systems Int. J. Heat Mass Transfer 54 2011 345 355
16. E. Prather, B. Puranik, Three-dimensional simulation of thermoelectric devices with compact numerical models, in: Proceedings of International Electronic Packaging Technical Conference and Exhibition, Hawaii, USA, 2003, pp. 335-342.
17. K.V. Karimanal, M.J. Ellsworth, G. Refai-Ahmed, A numerical technique for modeling thermoelectric cooler with temperature controller for steady state CFD applications, in: Proceedings of ASME International Mechanical Engineering Congress, Washington D.C., USA, 2003, pp. 245-251.
18. M. Gonzalez, E. Arguelles, J. Rodreguez, and M. Garcia Thermal performance of a controlled cooling system for low-level optical signals Appl. Therm. Eng. 24 2004 2041 2054
19. I. Sauciuc, H. Erturk, G. Chrysler, V. Bala, R. Mahajan, Thermal devices integrated with thermoelectric modules with applications to CPU cooling, in: Proceedings of ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems, San Francisco, USA, 2005, pp. 2149-2155.
20. N. Lakhkar, M. Hossain, D. Agonafer, CFD modeling of a thermoelectric device for electronics cooling applications, in: Proceedings of 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, USA, 2008, pp. 889-895.
21. M. Pearse, Modelling methodology for thermo-electric coolers in CFD, in: Proceedings of 2nd Electronics System-Integration Technology Conference, Greenwich, UK, 2008, pp. 1171-1174.
22. Q. Nie, and Y. Joshi Multiscale thermal modeling methodology for thermoelectrically cooled electronic cabinets Numer. Heat Transfer A 53 2008 225 248 (Pubitemid 350083444)
23. M.P. Gupta, M. Sayer, S. Mukhopadhyay, and S. Kumar Ultrathin thermoelectric devices for on-chip Peltier cooling IEEE Trans. Compon. Packag. Manuf. Technol. 1 2011 1395 1405
24. S. Lineykin, and S. Ben-Yaakov Modeling and analysis of thermoelectric modules IEEE Trans. Ind. Appl. 43 2007 505 512 (Pubitemid 46563086)
25. S. Lineykin, and S. Ben-Yaakov User-friendly and intuitive graphical approach to the design of thermoelectric cooling systems Int. J. Refrig. 30 2007 798 804 (Pubitemid 46891064)
26. F.L. Tan, and S.C. Fok Methodology on sizing and selecting thermoelectric cooler from different TEC manufacturers in cooling system design Energy Convers. Manage. 49 2008 1715 1723
27. H.N. Phan, and D. Agonafer Thermoelectric cooling analysis using modified-graphical-method for multidimensional-heat-transfer-system ASME J. Electron. Packag. 133 2011 031003
28. A.F. Ioffe Semiconductor Thermoelements and Thermoelectric Cooling 1957 Infosearch Limited London
29. Marlow industries inc., Thermoelectric Cooler Datasheet DT12-4.
30. M. Chen, L.A. Rosendahl, T.J. Condra, and J.K. Pedersen Numerical modeling of thermoelectric generators with varying material properties in a circuit simulator IEEE Trans. Energy Convers. 24 2009 112 124
31. K. Yazawa, and A. Shakouri Cost-efficiency trade-off and the design of thermoelectric power generators Environ. Sci. Technol. 45 2011 7548 7553
32. X. Gao, M. Chen, G.J. Snyder, S.J.Andreasen, S.K.Kær, Thermal management optimization of a thermoelectric-integrated methanol evaporator using a compact CFD modeling approach, Journal of Electronic Materials (2013). http://dx.doi.org/10.1007/s11664-013-2514-2.