Transferable and flexible thin film devices for engineering applications

Journal of Micromechanics and Microengineering

Volumn 24, Issue 5, 2014, Pages

  Mutyala, Madhu Santosh K ^a   Zhou, Jingzhou ^b   Li, Xiaochun ^b  

^a University of Wisconsin Madison   (United States)

^b Engineering IV   (United States)

Author keywords

flexible; oxygen plasma; polyimide; surface modification; TFTC

Indexed keywords

CURING; ENERGY CONVERSION; FABRICATION; METAL FOIL; OXYGEN; POLYIMIDES; PROCESS MONITORING; SUBSTRATES; SURFACE TREATMENT; THERMOCOUPLES; THIN FILM DEVICES; THIN FILMS; ULTRASONIC APPLICATIONS; WIRELESS TELECOMMUNICATION SYSTEMS;

EMBEDDED ELECTRONIC DEVICES; ENERGY CONVERSION SYSTEMS; ENGINEERING APPLICATIONS; FLEXIBLE; OXYGEN PLASMAS; SOLID STATE ELECTRONICS; TFTC; ULTRASONIC METAL WELDING;

GLASS;

EID: 84899560720     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/24/5/055019     Document Type: Article

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