Enhancement of adhesion between copper foil and polyimide film containing thermally decomposable polystyrene particles

Journal of Applied Polymer Science

Volumn 126, Issue SUPPL. 2, 2012, Pages

  Tsai, Mei Hui ^a   Huang, Yi Chia ^b   Tseng, I Hsiang ^a   Yu, Hsin Pei ^a   Lin, Yin Kai ^b  

^a NATIONAL CHIN YI UNIVERSITY OF TECHNOLOGY   (Taiwan)

^b NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

adhesion; polystyrene; porous polyimide

Indexed keywords

COPPER FOILS; CU FOIL; DIMETHYLACETAMIDE; FACILE METHOD; OXYDIANILINE; PEEL TESTS; PI FILM; POLYIMIDE FILM; POLYSTYRENE PARTICLE; PS CONTENTS; PYROMELLITIC DIANHYDRIDE; SURFACE AREA; THERMAL IMIDIZATION;

ADHESION; BOND STRENGTH (MATERIALS); METAL CLADDING; POLYIMIDES; POLYMERIC FILMS; POLYSTYRENES; SURFACE ROUGHNESS;

COPPER;

EID: 84864697993     PISSN: 00218995     EISSN: 10974628     Source Type: Journal    
DOI: 10.1002/app.36615     Document Type: Article

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