Adhesion study in aluminum/polyimide system

Materials Research Society Symposium - Proceedings

Volumn 511, Issue , 1998, Pages 377-382

  Yoo, S H ^a   Heo, S J ^a   Kim, Y H ^a   Han, B J ^a   Yoon, J H ^a  

^a Hanyang University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; CURING; DEPOSITION; MAGNETRON SPUTTERING; PLASMA APPLICATIONS; POLYIMIDES; STRENGTH OF MATERIALS; SUBSTRATES; THIN FILMS;

ADHESION STRENGTH; PEEL STRENGTH; PLASMA CLEANING;

ADHESION;

EID: 0032299705     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-511-377     Document Type: Conference Paper

References (12)