Polyimide surface treatment by atmospheric pressure plasma for metal adhesion

Journal of the Electrochemical Society

Volumn 157, Issue 12, 2010, Pages

  Park, J B ^a   Oh, J S ^a   Gil, E L ^a   Kyoung, S J ^a   Lim, J T ^a   Yeom, G Y ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION STRENGTHS; AG FILMS; ATMOSPHERIC PRESSURE PLASMAS; CHEMICAL BONDINGS; CO-BONDING; DIELECTRIC BARRIER DISCHARGES; GAS COMPOSITIONS; GAS FLOWS; HIGH-CONTENT; INTERFACIAL ADHESION STRENGTH; LOW PRESSURE PLASMA; METAL ADHESION; METAL THIN FILM; OXYGEN RADICAL; PEEL STRENGTH; PLASMA SURFACE TREATMENT; PLASMA TREATMENT; SUBSTRATE SURFACE;

ADHESION; ATMOSPHERIC PRESSURE; BOND STRENGTH (MATERIALS); CHEMICAL BONDS; CONTACT ANGLE; ELECTRIC DISCHARGES; FLOW OF GASES; GAS PERMEABLE MEMBRANES; INORGANIC COATINGS; OXYGEN; PLASMA DEPOSITION; PLASMAS; POLYIMIDES; SILVER;

SURFACE TREATMENT;

EID: 78449283719     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3493585     Document Type: Article

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