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Volumn 115, Issue 12, 2014, Pages

Qualitative link between work of adhesion and thermal conductance of metal/diamond interfaces

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CALCULATIONS; DIAMONDS; ELECTRONIC STRUCTURE; HYDROGEN; THERMAL CONDUCTIVITY;

EID: 84898022804     PISSN: 00218979     EISSN: 10897550     Source Type: Journal    
DOI: 10.1063/1.4869668     Document Type: Article
Times cited : (52)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.