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Surface and Coatings Technology

Volumn 200, Issue 16-17, 2006, Pages 4891-4896

Molybdenum interlayers as adhesion promotors for thin copper films on plasma treated glassy carbon

(6) Schwarz, Bernhard a Schrank, C a Eisenmenger Sittner, C a Stoger Pollach M a Rosner, M a Neubauer, E b

a VIENNA UNIVERSITY OF TECHNOLOGY (Austria)

b ARC SEIBERSDORF RESEARCH GMBH (Austria)

Author keywords

Adhesion promotor; Copper; De wetting; Glassy carbon; MMC; Molybdenum

Indexed keywords

ADHESION; CARBON; COMPOSITION EFFECTS; GRAIN BOUNDARIES; INTERFACES (MATERIALS); MOLYBDENUM; PLASMA APPLICATIONS; SECONDARY ION MASS SPECTROMETRY; THERMAL EFFECTS; THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY;

ADHESION PROMOTORS; DEWETTING; MOLYBDENUM INTERLAYERS;

COPPER;

ADHESION; CARBON; COMPOSITION EFFECTS; COPPER; GRAIN BOUNDARIES; INTERFACES (MATERIALS); MOLYBDENUM; PLASMA APPLICATIONS; SECONDARY ION MASS SPECTROMETRY; THERMAL EFFECTS; THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY;

EID: 33644990389 PISSN: 02578972 EISSN: None Source Type: Journal
DOI: 10.1016/j.surfcoat.2005.04.042 Document Type: Article

Times cited : (16)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.