Thermal stresses analysis in adhesive/solder bonded bimaterial assemblies

Journal of Applied Physics

Volumn 104, Issue 11, 2008, Pages

  Wang, Jialai ^a   Zeng, Shixin ^a  

^a Univ of Alabama   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; COMPUTER SIMULATION; FINITE ELEMENT METHOD; MODAL ANALYSIS; STRENGTH OF MATERIALS; STRESS CONCENTRATION; TENSILE STRENGTH; THERMAL SPRAYING; THERMAL STRESS; THERMOELASTICITY;

ADHESIVE LAYERS; ANALYTICAL MODELS; COEFFICIENT OF THERMAL EXPANSIONS; ELASTIC FOUNDATIONS; FINITE ELEMENT ANALYSIS; FREE EDGES; PARAMETRIC STUDIES; PEELING STRESSES; PHYSICAL DESIGNS; SHORT-COMINGS; STRESS BOUNDARY CONDITIONS;

THERMAL EXPANSION;

EID: 58149267574     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3021357     Document Type: Article

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