Investigations on the role of alkali to obtain modulated defect concentrations for Cu 2 O thin films

Applied Surface Science

Volumn 289, Issue , 2014, Pages 430-436

  Chowdhury, Anirban ^a   Bijalwan, Pavan Kumar ^a   Sahu, Ranjan Kumar ^b  

^a TATA STEEL LTD   (India)

^b NATIONAL METALLURGICAL LABORATORY   (India)

Author keywords

Cuprous oxide; Defect; Photoluminescence (PL) spectroscopy; Successive ionic layer adsorption and reaction (SILAR); Vacancy; X ray photoelectron spectroscopy (XPS)

Indexed keywords

BINDING ENERGY; COPPER OXIDES; DEFECTS; MICROSTRUCTURE; PHOTOELECTRONS; PHOTOLUMINESCENCE; PHOTOLUMINESCENCE SPECTROSCOPY; PHOTONS; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTOR QUANTUM WELLS; STRUCTURAL OPTIMIZATION; THIN FILMS; ULTRAVIOLET VISIBLE SPECTROSCOPY; VACANCIES; X RAY PHOTOELECTRON SPECTROSCOPY;

ALKALI CONCENTRATIONS; CUPROUS OXIDE; DEFECT CONCENTRATIONS; LARGE AREA DEVICES; SUCCESSIVE IONIC LAYER ADSORPTION AND REACTIONS; SURFACE REACTIVITY; UNIFORM MICROSTRUCTURE; VACANCY CONCENTRATION;

COPPER ALLOYS;

EID: 84890552147     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2013.10.183     Document Type: Article

References (68)

1. G.P. Pollack, and D. Trivich J. Appl. Phys. 46 1975 163
2. S. Kose, F. Atay, V. Bilgin, and I. Akyuz Mater. Chem. Phys. 111 2008 351
3. Y.H. Lee, I.C. Leu, S.T. Chang, C.L. Liao, and K.Z. Fung Electrochim. Acta 50 2004 553
4. A.J. Nozik Annu. Rev. Phys. Chem. 29 1978 189
5. T. Ito, H. Yamaguchi, K. Okabe, and T. Masumi J. Mater. Sci. 33 1998 3555
6. H. Solache-Carranco, G. Juárez-Díaz, A. Esparza-García, M. Briseño-García, M. Galván- Arellano, J. Martínez-Juárez, G. Romero-Paredes, and R. Peña-Sierra J. Lumin. 129 2009 1483
7. A. Musa, T. Akomolafe, and M. Carter Solar Energy Mater. Solar Cells 51 1998 305
8. Y.-Y. Su, and R.M. Shemenski Appl. Surf. Sci. 161 2000 355
9. Y.-Y. Su, and R.M. Shemenski Int. J. Adhes. Adhes. 21 2001 481
10. S.E. Schonfeld, F.J. Ravagnani, US4195679, Composition and product with improved adhesion between a metal member and a contiguous cured rubber skim stock (U.S. Patent 4195679, 1980), The Firestone Tire & Rubber Company.
11. D.A. Stout, and R.J. Rife J. Vac. Sci. Technol. A: Vac. Surf. Films 8 1990 2407
12. H.B. Fan, E.K.L. Chan, C.K.Y. Wong, and M.M.F. Yuen J. Electron. Packag. Trans. ASME 129 2007 35
13. M. Lebbai, J.K. Kim, W.K. Szeto, M.M.F. Yuen, and P. Tong J. Electron. Mater. 32 2003 558
14. P.W.K. Chung, M.M.F. Yuen, P.C.H. Chan, N.K.C. Ho, and D.C.C. Lam Effect of copper oxide on the adhesion behavior of Epoxy molding compound-copper interface Presented at Electronic Components & Technology Conference (ECTC) San Diego, CA 2002
15. R.A. Letize, US20080000552, Process for increasing the adhesion of a metal surface to a polymer (U.S. Patent 20080000552, 2008), p. 5.
16. A. Landau U.S4844981, Adhesion promoter for printed circuits, U.S. Patent 4844981 1989
17. Y.-Y. Su Wear 210 1997 165
18. Y.-Y. Su Tribol. Int. 30 1997 423
19. T. Mahalingam, J.S.P. Chitra, J.P. Chu, H. Moon, H.J. Kwon, and Y.D. Kim J. Mater. Sci.: Mater. Electron. 17 2006 519
20. K. Akimoto, S. Ishizuka, M. Yanagita, Y. Nawa, G.K. Paul, and T. Sakurai Solar Energy 80 2006 715
21. V. Georgieva, and M. Ristov Solar Energy Mater. Solar Cells 73 2002 67
22. C.C. Shih, C.M. Shih, Y.Y. Su, R.A. Gerhardt, and S.J. Lin J. Biomed. Mater. Res. - Part A 74 2005 325
23. C.-C. Shih, Y.-Y. Su, L.-C. Chen, C.-M. Shih, and S.-J. Lin Acta Biomater. 6 2010 2322
24. J.M. Bastidas, N. Mora, E. Cano, and J.L. Polo J. Mater. Sci.: Mater. Med. 12 2001 391
25. M. Ristov, G. Sinadinovski, and I. Grozdanov Thin Solid Films 123 1985 63
26. T.P. Niesen, and M.R. De Guire J. Electroceram. 6 2001 169
27. Y. Hameş, and S.E. San Solar Energy 77 2004 291
28. S.T. Shishiyanu, T.S. Shishiyanu, and O.I. Lupan Sens. Actuators B: Chem. 113 2006 468
29. M. Muhibbullah, and M. Ichimura Jap. J. Appl. Phys. 49 2010
30. M.R. Johan, M.S.M. Suan, N.L. Hawari, and H.A. Ching Int. J. Electrochem. Sci. 6 2011 6094
31. M.T.S. Nair, L. Guerrero, O.L. Arenas, and P.K. Nair Appl. Surf. Sci. 150 1999 143
32. E. Cano, C. Torres, and J. Bastidas Mater. Corros. 52 2001 667
33. I.G. Casella, and M. Gatta J. Electroanal. Chem. 494 2000 12
34. Y. Iijima, N. Niimura, and K. Hiraoka Surf. Interface Anal. 24 1996 193
35. N.S. McIntyre, and M.G. Cook Anal. Chem. 47 1975 2208
36. S. Poulston, P.M. Parlett, P. Stone, and M. Bowker Surf. Interface Anal. 24 1996 811
37. J.P. Tobin, W. Hirschwald, and J. Cunningham Applic. Surf. Sci. 16 1983 441
38. M. Yin, C.-K. Wu, Y. Lou, C. Burda, J.T. Koberstein, Y. Zhu, and S. O'Brien J. Am. Chem. Soc. 127 2005 9506
39. M.C. Biesinger, L.W.M. Lau, A.R. Gerson, and R.S.C. Smart Appl. Surf. Sci. 257 2010 887
40. C. Mosser, A. Mosser, M. Romeo, S. Petit, and A. Decarreau Clays Clay Miner. 40 1992 593
41. J.F. Watts, J. Wolstenholme, An Introduction to Surface Analysis by XPS and AES, by John F. Watts, John Wolstenholme, pp. 224. ISBN 0-470-84713-1. Wiley-VCH, May 2003, p. 1.
42. H. Shi, K. Yu, F. Sun, and Z. Zhu CrystEngComm 14 2012 278
43. H. Shi, K. Yu, Y. Wang, Q. Wang, and Z. Zhu Appl. Phys. A 108 2012 709
44. M. Zouaghi, B. Prevot, C. Carabatos, and M. Sieskind Physica Status Solidi (a) 11 1972 449
45. J.-W. Park, H. Jang, S. Kim, S.-H. Choi, H. Lee, J. Kang, and S.-H. Wei J. Appl. Phys. 110 2011 103503
46. T. Ito, and T. Masumi J. Phys. Soc. Jpn. 66 1997 2185
47. S. Lv, H. Suo, C. Wang, S. Jing, T. Zhou, Y. Xu, J. Wang, and C. Zhao Solid State Commun. 149 2009 404
48. E. Ko, J. Choi, K. Okamoto, Y. Tak, and J. Lee ChemPhysChem 7 2006 1505
49. Y. Xu, D. Chen, X. Jiao, and K. Xue J. Phys. Chem. C 111 2007 16284
50. X. Wen, W. Zhang, S. Yang, Z.R. Dai, and Z.L. Wang Nano Lett. 2 2002 1397
51. D. Dodoo-Arhin, M. Leoni, and P. Scardi Mol. Cryst. Liquid Cryst. 555 2012 17
52. W. Jisen, Y. Jinkai, S. Jinquan, and B. Ying Mater. Des. 25 2004 625
53. W. Wang, Y. Zhan, and G. Wang Chem. Commun. 2001 727
54. K. Rajeshwar, N.R. de Tacconi, G. Ghadimkhani, W. Chanmanee, and C. Janáky ChemPhysChem 14 2013 2251
55. P. Kubelka J. Opt. Soc. Am. 38 1948 448
56. E.L. Simmons Appl. Opt. 14 1975 1380
57. B. Balamurugan, and B.R. Mehta Thin Solid Films 396 2001 90
58. P.B. Ahirrao, B.R. Sankapal, and R.S. Patil J. Alloys Compd. 509 2011 5551
59. F. Biccari Defects and Doping in Cu PhD Thesis 2010 University of Rome, Sapienza
60. L. Xiong, S. Huang, X. Yang, M. Qiu, Z. Chen, and Y. Yu Electrochim. Acta 56 2011 2735
61. N. Zhang, Y.L. Du, Y. Zhang, and C.M. Wang J. Mater. Chem. 21 2011 5408
62. K. Jayathileke, W. Siripala, and J. Jayanetti Sri Lankan J. Phys. 9 2008 35
63. S. Dutta, M. Chakrabarti, S. Chattopadhyay, D. Jana, D. Sanyal, and A. Sarkar J. Appl. Phys. 98 2005 053513
64. S. Dutta, S. Chattopadhyay, D. Jana, A. Banerjee, S. Manik, S.K. Pradhan, M. Sutradhar, and A. Sarkar J. Appl. Phys. 100 2006 114328
65. O. Mohanta, Y.N. Singhbabu, S.K. Giri, D. Dadhich, N.N. Das, and R.K. Sahu J. Alloys Compd. 564 2013 78
66. M. O'Keeffe, and F.S. Stone Proc. Roy. Soc. Lond. Series A: Math. Phys. Sci. 267 1962 501
67. R.J. Cava Science 247 1990 656
68. J. Xue, and R. Dieckmann J. Phys. Chem. Solids 51 1990 1263