Effect of copper oxide on the adhesion behavior of epoxy molding compound-copper interface

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 1665-1670

  Chung, Paular W K ^a   Yuen, Matthew M F ^a   Chan, Philip C H ^a   Ho, Nick K C ^a   Lam, David C C ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

MECHANICAL STRESSES;

ADHESION; COPPER OXIDES; EPOXY RESINS; INTERFACES (MATERIALS); STRESS ANALYSIS; THERMAL CYCLING; THIN FILMS; X RAY PHOTOELECTRON SPECTROSCOPY;

ELECTRONICS PACKAGING;

EID: 0036287542     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2002.1008331     Document Type: Conference Paper

References (15)

1. An oxidation study of Cu leadframes
2. Oxide thickness determination by XPS, AES, SIMS, RBS and TEM
3. RBS measurement of the thickness of nanometer oxide layers: Adhesion strength between copper leadframe and molding compound correlated with the oxide layer thickness
4. Optimal oxidation control for enhancement of copper lead frame-EMC adhesion in packaging process
5. Oxide adhesion characteristic of lead frame copper alloys
6. The effect of the oxidation of Cu-base leadframe on the interface adhesion between Cu metal and epoxy molding compound
7. Effect of oxidation on mold compound-copper leadframe adhesion
8. Investigation on the effect of copper leadframe oxidation on package delamination
9. The oxidation control of Copper leadframe package for prevention of popcorn cracking
10. Mold compound adhesion and strength
11. Shear test for adhesion measurement of small structures
12. Surface treatment of copper for the adhesion improvement to epoxy mold compounds
13. Effect of the microstructure of copper oxide on the adhesion behavior of epoxy/copper leadframe joints
14. The role of oxide structure on copper wire to the rubber adhesion